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Spinel resistivity

Spinel ferrites, isostmctural with the mineral spinel [1302-67-6] MgAl204, combine interesting soft magnetic properties with a relatively high electrical resistivity. The latter permits low eddy current losses in a-c appHcations, and based on this feature spinel ferrites have largely replaced the iron-based core materials in the r-f range. The main representatives are MnZn-ferrites (frequencies up to about 1 MH2) and NiZn-ferrites (frequencies 1 MHz). [Pg.187]

There are no significant high-temperature applications for alloys of nickel with iron. The scales formed in air consist of nickel oxide and iron oxide and the latter is usually present in the form of the spinel, NiO-FejOj . In the case of the more dilute nickel alloys, internal oxidation of nickel was Observed S. Substitution of a substantial proportion of nickel by iron results in a deterioration in the oxidation resistance of nickel-chromium... [Pg.1052]

Impurity substitution that is effectively neutral, that is, neither donor nor acceptor, can also lead to significant changes in properties that are utilized in NTC thermistors. For example, the replacement of Ga3+ in the spinel MgGa204 by Mn3+ involves no apparent donor or acceptor action. The conductivity in the system MgGa2 Jt.MnJt.04 evolves from insulating (conductivity about 10-9 0 1m 1) for the parent phase with x = 0, to a conductivity approximately equal to that of germanium (10 10-1 m-1) in the compound MgGaMn04, in which x = 1. The resistivity decreases markedly with temperature and the compounds display typical NCT behavior. [Pg.357]

The electrical conductivity requirement for interconnect applications necessitates the use of chromia-forming (or Cr-rich spinel) oxidation-resistant alloys. One drawback of the chromia-forming alloys for this particular application, however, is the Cr volatility of the chromia or Cr-rich scale. As indicated by many studies [185-189], during high-temperature exposure Cr203 (s) reacts with 02 via the following reaction... [Pg.195]

Besides the glass seal interfaces, interactions have also been reported at the interfaces of the metallic interconnect with electrical contact layers, which are inserted between the cathode and the interconnect to minimize interfacial electrical resistance and facilitate stack assembly. For example, perovskites that are typically used for cathodes and considered as potential contact materials have been reported to react with interconnect alloys. Reaction between manganites- and chromia-forming alloys lead to formation of a manganese-containing spinel interlayer that appears to help minimize the contact ASR [219,220], Sr in the perovskite conductive oxides can react with the chromia scale on alloys to form SrCr04 [219,221],... [Pg.198]

Given that the structural transformation of the a-NaFe02-type layered and orthorhombic structures to spinel only requires cation migration, the varying resistance of transition-metal compositions against the transformation (i.e., low resistance for Mn, high for Co) is most likely connected to the diffusion kinetics of the respective 3d transition-metal ions. [Pg.276]


See other pages where Spinel resistivity is mentioned: [Pg.188]    [Pg.190]    [Pg.194]    [Pg.115]    [Pg.116]    [Pg.437]    [Pg.375]    [Pg.10]    [Pg.13]    [Pg.13]    [Pg.37]    [Pg.40]    [Pg.370]    [Pg.423]    [Pg.349]    [Pg.359]    [Pg.359]    [Pg.359]    [Pg.208]    [Pg.250]    [Pg.979]    [Pg.1045]    [Pg.1045]    [Pg.1046]    [Pg.402]    [Pg.403]    [Pg.476]    [Pg.47]    [Pg.202]    [Pg.99]    [Pg.193]    [Pg.194]    [Pg.200]    [Pg.201]    [Pg.202]    [Pg.196]    [Pg.158]    [Pg.331]    [Pg.136]    [Pg.43]    [Pg.72]    [Pg.150]    [Pg.275]   
See also in sourсe #XX -- [ Pg.497 ]




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