Big Chemical Encyclopedia

Chemical substances, components, reactions, process design ...

Articles Figures Tables About

Solid lied process

The electrochemical mechanism of dissolution is illustrated schematically by the simplified polarization diagram shown in Fig. 2. The open circuit potentials of the cathode process, E, and the anodic process. Eg, are the equilibrium potentials of the corresponding partial reactions of Eqs. 28 and 29. The dissolution current corresponds to the steady-state rate of dissolution. The corresponding dissolution potential of the dissolving solid lies between the equilibrium values of the cathodic and anodic reactions. From the figure, it also follows that conditions which shift the point of intersection of the anodic and cathodic polarization curves by decreasing their slopes, lead to an increase in dissolution rate. Conversely, an increase in the slopes of the curves lowers the dissolution rate. [Pg.65]

The significance of this novel attempt lies in the inclusion of both the additional particle co-ordinate and in a mechanism of particle disruption by primary particle attrition in the population balance. This formulation permits prediction of secondary particle characteristics, e.g. specific surface area expressed as surface area per unit volume or mass of crystal solid (i.e. m /m or m /kg). It can also account for the formation of bimodal particle size distributions, as are observed in many precipitation processes, for which special forms of size-dependent aggregation kernels have been proposed previously. [Pg.245]

Metal/molten salt interfaces have been studied mainly by electrocapillary833-838 and differential capacitance839-841 methods. Sometimes the estance method has been used.842 Electrocapillary and impedance measurements in molten salts are complicated by nonideal polarizability of metals, as well as wetting of the glass capillary by liquid metals. The capacitance data for liquid and solid electrodes in contact with molten salt show a well-defined minimum in C,E curves and usually have a symmetrical parabolic form.8 10,839-841 Sometimes inflections or steps associated with adsorption processes arise, whose nature, however, is unclear.8,10 A minimum in the C,E curve lies at potentials close to the electrocapillary maximum, but some difference is observed, which is associated with errors in comparing reference electrode (usually Pb/2.5% PbCl2 + LiCl + KC1)840 potential values used in different studies.8,10 It should be noted that any comparison of experimental data in aqueous electrolytes and in molten salts is somewhat questionable. [Pg.147]

All ore mineral deposits lie in or on solid rocks of which the Earth s crust is predominantly composed. The geological processes which are responsible for the formation of rocks also form the ore bodies associated with them. For the formation of an ore body, the metal or metals concerned must be enriched to a considerably higher level than their normal crustal abundance. The degree of such enrichment below which the extraction cost makes the processing of the ore uneconomical is termed the concentration factor. Typical values of the concentration factor for some of the common metals are given in Table 1.5. [Pg.40]

An important developing area that lies in the region between polymer chemistry, ceramic science, and metals, involves the search for new electrically-conducting solids. Linear polymers may conduct electricity by electronic or ionic mechanisms. As will be discussed, polyphosphazenes have been synthesized that, depending on the side group structure, conduct by either of these two processes. [Pg.252]

Studies of the energetics and dynamics of Cu2 and Ag2 in rare gas solids have also been completed (31,34). The absorption and fluorescence spectra are similarly indicative of strong guest-host interactions in the low lying states of Cu2 and Ag2 Rather than presenting the spectroscopic and photolytic details, a summary of the observed radiative relaxation processes of visible and uv excited Cu2 and Ag2 in rare gas solids is shown below ... [Pg.307]


See other pages where Solid lied process is mentioned: [Pg.523]    [Pg.263]    [Pg.83]    [Pg.467]    [Pg.281]    [Pg.159]    [Pg.459]    [Pg.159]    [Pg.100]    [Pg.492]    [Pg.1264]    [Pg.366]    [Pg.16]    [Pg.208]    [Pg.479]    [Pg.718]    [Pg.195]    [Pg.142]    [Pg.527]    [Pg.947]    [Pg.244]    [Pg.78]    [Pg.217]    [Pg.187]    [Pg.374]    [Pg.196]    [Pg.766]    [Pg.26]    [Pg.444]    [Pg.488]    [Pg.59]    [Pg.298]    [Pg.219]    [Pg.609]    [Pg.788]    [Pg.324]    [Pg.431]    [Pg.303]    [Pg.236]    [Pg.311]    [Pg.222]    [Pg.439]    [Pg.113]    [Pg.24]    [Pg.124]   


SEARCH



Lies, lying

Lying

Solid lied process costs

Solid lied process description

Solid lied process designing

Solid lied process pressures

Solid lied process temperatures

Solid process

Solids processing

© 2024 chempedia.info