Solder materials nitrogen

Area-array devices have one thing in common their solder joints are hidden by the package body and it is impossible to repair an isolated open solder joint beneath the package. Nitrogen provides added insurance that best solder wetting will result if soldering conditions and materials are process-appropriate. 

A specialized type of Li-ion battery developed for semi-conductor and printed circuit board (PCB) applications are thin-film, solid-state devices. These batteries which employ ceramic negative, solid electrolyte and positive electrode materials, can sustain high temperatures (250°C), and can be fabricated by high volume manufacturing techniques on silicon wafers which are viable as on-chip or on-board power sources for microelectronics. Batteries of this type can be very small, 0.04 cm x 0.04 cm x 2.0 fjm. For microelectronics applications, all components must survive solder re-flow conditions, nominally 250°C in air or nitrogen for 10 minutes. Cells with liquid or polymer electrolytes cannot sustain these conditions because of the volatility or thermal stability of organic components. Further, cells that employ lithium metal also fail as solder re-flow conditions exceed the melting point of lithium (180.5°C). 

Base Metal Conductors. Copper conductors have gained some acceptance over the past decade because of their relatively low metal cost, low resistivity, good adhesion on AljOj substrates, excellent solder leach resistance, and low migration tendency. Advances in compatible thick film dielectric formulations have resulted in significant use of Cu in multilayer interconnect boards, primarily for military applications. Also, uses of Cu conductor materials have included power hybrid and microwave-related applications. Their applications in more complex systems and networks have been limited by the availability of state-of-the-art nitrogen-firable resistor systems. However, there are additional factors that complicate the widespread usage of this versatile material. 

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