Situ Plasma Cleaning in Micro-Electronics and Related Environmental Issues

In Situ Plasma Cleaning in Micro-Electronics and Related Environmental Issues 

The in situ plasma cleaning procedure performed after CVD of dielectric thin films is one of the major emitters of PFCs in semiconductor manufacturing it can represent 50-70% of the total PFC emission in a semiconductor fabrication plant. To clean the process chambers of deposited by-products, conventional cleaning methods use CF4 or C2F6 gases activated by RF CCP (usually 13.56 MHz) inside the process chamber. These PFC gases achieve a relatively low degree of dissociation and unreacted molecules are enutted in the process 

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