Silver-glass pastes

Vitreous materials comprise a third type of attachment material. Glasses may be used to seal lids to packages for hermetic enclosures. Silver-glass pastes have been developed for die attachment. They have high thermal and electrical conductivities and are used extensively for single die attachment in single packages. 

Silver-glass paste adhesive Silver JMl-5160 Ablestik Labs. 78.3... 

Silver-glass paste adhesive Silver Ablebond 2005 Ablestik Labs. >90... 

The commercial silver-silver chloride electrode is similar to the SCE in that it is enclosed in glass, has nearly the same size and shape, and has a porous fiber tip for contact with the external solution. Internally, however, it is different. There is only one glass tube (unless it is a double-junction design—see Section 14.5.3) and a solution saturated in silver chloride and potassium chloride is inside. A silver wire coated at the end with a silver chloride paste extends into this solution from the external lead. See Figure 14.5. The half-reaction that occurs is... 

DM 3030, Silver/glass die attach paste. Thermally Conductive Adhesives Selection Guide. Diemat, a Namics Co, www.diemat.com 2003. 

Silver-Through-Hole Technology. STH boards are usually made of paper phenolic materials or composite epoxy paper and glass materials, such as CE-1 or CE-3. After doublesided copper-clad materials are etched to form conductor patterns on both sides of the panel, holes are formed by drUUng. Then the panel is screened with silver-filled conductive paste. Instead of silver, copper paste can also be used. 

A microdisk electrode can be manufactured as follows. A fine platinum wire (it is easy to use a wire 10-50 pm in diameter) is enclosed in a pyrex cjq>illary with a lead copper wire that is fixed by silver/epoxy paste. After sanding the glass surface with an emery paper and exposing the platinum wire, the electrode sur ce is mirror polished by a diamond paste followed by alumina (see Fig. 3). 

FIGURE 10.2 Schematic design of a solid contact micropipette tip (A) copper wire, (B) silver epoxy paste or mercury, (C) glass capillary, (D) PEDOT-coated carbon fiber (OD 33 pm), and (E) ion-selective cocktail. 

Metal powder—glass powder—binder mixtures are used to apply conductive (or resistive) coatings to ceramics or metals, especially for printed circuits and electronics parts on ceramic substrates, such as multichip modules. Multiple layers of aluminum nitride [24304-00-5] AIN, or aluminay ceramic are fused with copper sheet and other metals in powdered form. The mixtures are appHed as a paste, paint, or slurry, then fired to fuse the metal and glass to the surface while burning off the binder. Copper, palladium, gold, silver, and many alloys are commonly used. 

Figure 3.25 — Electrolytic flow-cell of the tubular type. (A) Whole cell. (B) Detail of working micro-electrode 1 Working electrode 2 reference electrode (Ag/AgCl) 3 counter-electrode (Pt wire) 4 acrylic tube 5 rubber cup 6 electrolyte solution (mobile phase) 7 fused-silica tube (50- or 100-/tm ID) 8 Ni wire (diameter 25 or 50 im, length 5 mm) 9 PTFE tube (0.1-mm ID, 2-mm OD) 10 hole 11 adhesive resin 12 glass pipette 13 silver paste 14 insulator 15 electric wire, (Reproduced from [184] with permission of Elsevier Science Publishers).

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