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Junction Design

The commercial silver-silver chloride electrode is similar to the SCE in that it is enclosed in glass, has nearly the same size and shape, and has a porous fiber tip for contact with the external solution. Internally, however, it is different. There is only one glass tube (unless it is a double-junction design—see Section 14.5.3) and a solution saturated in silver chloride and potassium chloride is inside. A silver wire coated at the end with a silver chloride paste extends into this solution from the external lead. See Figure 14.5. The half-reaction that occurs is... [Pg.401]

Continuous-Flow Fast Atom Bombardment Interface Although currently not a popular approach, the coupling of CE mass spectrometry was once achieved via a CF-FAB probe. Makeup flow is required in this coupling because of the mismatch of the low flow rates of the CE solution with the liquid flow rates of stable CF-FAB operation. The sheath-flow and liquid-junction designs discussed above have been used successfully for this purpose [69-71], The sheath-flow design has the advantages that the composition and the flow rates of the CE effluents and of the FAB matrix solution can be optimized independently, and that the separation efficiency is higher. [Pg.180]

TRL junction design models ARCADY, PICADY and OSCADY provide accident predictions for specific junction layouts. [Pg.36]

The particle size of typical natural mbber latex ranges from slightly higher than 1 )Tm to as small as 20 nm, and can be destabilized by mechanical or chemical action. Machinery used to stir or maintain latex circulation should be designed to minimize fluid shear, particularly where that may be locally intensified, eg, at the junction of blade with shaft. [Pg.252]

As one can see by the typical values of the junction-to-air thermal resistance, it doesn t require much power to result in very high junction temperatures. If the designer can possible mount the power package on any metal surface to increase the radiating surface area, it will only improve the junction temperature. [Pg.190]

Design small diameter lines to the same codes, and test to the same standards, as main lines reinforce junctions as necessary. [Pg.405]


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Junction devices design

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