Big Chemical Encyclopedia

Chemical substances, components, reactions, process design ...

Articles Figures Tables About

Silicon rotation

Now, molten silicon is produced from a material called polysilicon, which has been stacked in a closed oven. Specific quantities of doping materials such as arsenic, phosphorus, boron, and antimony are added to the mixture, according to the conducting properties desired for the silicon chips that will be produced. The polysilicon melt is rotated in one direction (clockwise) then, a seed crystal of silicon, rotating in the opposite direction (counterclockwise), is introduced. The melt is carefully cooled to a specific temperature as the seed crystal structure is drawn out of the molten mass at a rate that determines the diameter of the resulting crystal. [Pg.619]

The setup as seen in Figure 1 mainly consists of a Varian Linatron 3000A linear accelerator (LINAC) as radiation source, a rotational stage for sample manipulation, and a two-dimensional high-energy x-ray detector array consisting of four amorphous silicon area detectors Heimann RIS 256. The source to detector distance is 3.7 m. [Pg.492]

The design and operation of a flow visualization system for highly viscous fluids, such as silicon rubber, has been reported by Ghafouri and Freakley (1994). This system consists mainly of a rotating roll and fixed-blade assembly, as is shown in Figure 5.7, and can be used to generate and maintain, essentially. [Pg.150]

A typical 20-MW, a-c furnace is fitted with three 45-in. (114.3-cm) prebaked amorphous carbon electrodes equdateraHy spaced, operating on a three-phase delta connection. The spacing of the electrodes is designed to provide a single reaction zone between the three electrodes. The furnace is rotated to give one revolution in two to four days or it may be oscillated only. Rotation of the furnace relative to the electrodes minimizes silicon carbide buildup in the furnace. [Pg.535]

There is no limit to the possible configurations of electric furnaces. They exist as single-phase or polyphase, a-c or d-c, and one to six or more electrodes. The furnace cross sections can be round, heart-shaped, oval, rectangular, or variations of each. Some furnaces, especially those for silicon production, have a rotating hearth and shell. [Pg.520]

Silicone Rubber. These polymers are based on chains of siUcon rather than carbon atoms, and owe thek temperature properties to thek unique stmcture. The most common types of siUcone mbbers are specifically and almost exclusively the polysdoxanes. The Si—O—Si bonds can rotate much more freely than the C—C bond, or even the C—O bond, so the siUcone chain is much more flexible and less affected by temperature (see Silicon COMPOUNDS, silicones). [Pg.470]

If a sample of polycrystalline material is rotated during the sputtering process, the individual grains will be sputtered from multiple directions and nonuniform removal of material can be prevented. This technique has been successfully used in AES analysis to characterize several materials, including metal films. Figure 9 indicates the improvement in depth resolution obtained in an AES profile of five cycles of nickel and chromium layers on silicon. Each layer is about 50 nm thick, except for a thinner nickel layer at the surface, and the total structure thickness is about 0.5 pm. There can be a problem if the surface is rough and the analysis area is small (less than 0.1-pm diameter), as is typical for AES. In this case the area of interest can rotate on and off of a specific feature and the profile will be jagged. [Pg.708]

The rotational barrier in methylsilane (Table 3.4, entry 5) is significantly smaller than that in ethane (1.7 versus 2.88 kcal/mol). This reflects the decreased electron-electron rqjulsions in the eclipsed conformation resulting from the longer carbon-silicon bond length (1.87 A) compared to the carbon-carbon bond length (1.54 A) in ethane. [Pg.131]

The fermenters are inoculated with 7.5% by volume of a 24-hour old culture of Aspergillus sderotiorum Huber grown at 28°C in 50 ml aliquots of the above described soybean-glucose medium contained in 300 ml Erlenmeyer flasks, placed on a shaker rotating at approximately 230 rpm. The inoculated fermenters are agitated at 1,380 rpm and each aerated with 1 liter of air per minute and at a temperature of 28°C for 47 hours. A silicone antifoam is added when required. At the end of the 47-hour period, the pH of the fermentation broth rose to 6.8 to 6.9. Sulfuric acid is then added with sterile precautions to restore the pH to 6.5. [Pg.1126]

In the presence of catalytic amounts of Pd(0), silicon-substituted vinyloxiranes can rearrange into the corresponding ot-silyl- 3,y-unsaturated aldehydes (Scheme 9.34) [151]. Treatment of 80 with Pd(OAc)2 and P(OPh)3 results in the formation of 7t-allylpalladium complex 81. Bond rotation to give 82, followed by migration of the silyl moiety, affords aldehyde 83, which is trapped in situ to provide the Felkin-Anh product 84. The reaction proceeds with retention of configuration and the ee of the starting material is retained in the product. The size of the silicon substituents is critical for the outcome of the reaction, as is the choice of ligands on palladium. [Pg.340]

For comparison, we carried out some reactions under vacuum in a rotating 50 ml flask. The flask was attached to a rotavap apparatus and heated in a silicon oil bath, the vacuum applied was 3 mbar. [Pg.139]

Figure 7. Net silicon deposition rates as a function of susceptor temperature for both hydrogen and helium as the carrier gas. Rotation rate is 1000 rpm. Figure 7. Net silicon deposition rates as a function of susceptor temperature for both hydrogen and helium as the carrier gas. Rotation rate is 1000 rpm.
Metal and polysilicon films are formed by a chemical-vapor deposition process using organometallic gases that react at the surface of the IC structure. Various metal silicide films may also be deposited in this manner by reaction with the surface of the silicon wafer to form metal silicides. Glass and pol3uner films are deposited or spin cast or both, as are photoresist films (those of a photosensitive material). This process is accomplished by applying a liquid polymer onto a rapidly rotating wafer. The exact method used varies from manufacturer to manufacturer and usually remains proprietary. [Pg.329]


See other pages where Silicon rotation is mentioned: [Pg.105]    [Pg.105]    [Pg.914]    [Pg.105]    [Pg.105]    [Pg.914]    [Pg.65]    [Pg.191]    [Pg.400]    [Pg.389]    [Pg.469]    [Pg.704]    [Pg.815]    [Pg.823]    [Pg.379]    [Pg.475]    [Pg.506]    [Pg.680]    [Pg.702]    [Pg.903]    [Pg.345]    [Pg.112]    [Pg.610]    [Pg.111]    [Pg.252]    [Pg.300]    [Pg.64]    [Pg.516]    [Pg.9]    [Pg.54]    [Pg.38]    [Pg.201]    [Pg.781]    [Pg.1061]    [Pg.311]    [Pg.420]    [Pg.455]    [Pg.419]    [Pg.436]    [Pg.31]    [Pg.94]   
See also in sourсe #XX -- [ Pg.112 ]




SEARCH



Rotational energy, hydrogen/silicon

© 2024 chempedia.info