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Silicon aluminum metal

Alkoxides of nonmetals are described in articles about the corresponding compounds (see Boron COMPOUNDS, Boron oxides Silicon compounds). Metal alkyls, in which the alkyl group is bound direcdy to the metal, are also discussed elsewhere (see Aluminum compounds). [Pg.21]

Coprecipitation is a partitioning process whereby toxic heavy metals precipitate from the aqueous phase even if the equilibrium solubility has not been exceeded. This process occurs when heavy metals are incorporated into the structure of silicon, aluminum, and iron oxides when these latter compounds precipitate out of solution. Iron hydroxide collects more toxic heavy metals (chromium, nickel, arsenic, selenium, cadmium, and thorium) during precipitation than aluminum hydroxide.38 Coprecipitation is considered to effectively remove trace amounts of lead and chromium from solution in injected wastes at New Johnsonville, Tennessee.39 Coprecipitation with carbonate minerals may be an important mechanism for dealing with cobalt, lead, zinc, and cadmium. [Pg.796]

Looking for new anodic reactions, we first tried silicon/aluminum-alloys and silicon, doped with traces of different metals. However, the easily oxidizable components again formed metal salts, whereas the silicon remained unchanged. [Pg.368]

Toth A method proposed for making aluminum metal from clay. The dried clay, mixed with coke, is chlorinated to yield aluminum trichloride and silicon tetrachloride. The volatile chlorides are separated by distillation and the aluminum chloride then reduced with manganese metal ... [Pg.272]

In the structures cited in Table 12.3, except for pure silicon dioxide, metal ions are required for overall electrical neutrality. These metal ions are positioned in tetrahedral, octahedral, etc. positions in the silicate-like lattice. Sometimes they replace the silicon atom. Kaolinite asbestos has aluminum substituted for silicon in the Gibbosite sheet. Further, sites for additional anions, such as the hydroxyl anion, are available. In ring, chain, and sheet structures neighboring rings. [Pg.387]

The simple picture of the MOS capacitor presented in the last section is complicated by two factors, work function differences between the metal and semiconductor and excess charge in the oxide. The difference in work functions, the energies required to remove an electron from a metal or semiconductor, is 0ms = —25 meV for an aluminum metal plate over a 50-nm thermally grown oxide on -type silicon with n = 1016 cm-3. This work function difference leads to a misalignment of energy bands in the metal and semiconductor which has to be compensated by a variation of the energy band with distance. When there is no misalignment the flat-band condition results. [Pg.348]

Silicon dioxide films have been an essential factor in the manufacture of integrated circuits from the earliest days of the industry. They have been used as a final passivation film to protect against scratches and to getter mobile ion impurities (when doped with phosphorus). Another application has been as an interlayer dielectric between the gate polysilicon and the aluminum metal-ization. Initially, most such films were deposited in atmospheric pressure systems. In recent years, low pressure processes have assumed greater importance. We will begin by examining the atmospheric process. [Pg.66]

In the present chapter, we will review the nature of plasma-enhanced CVD (PECVD) films for a variety of applications. We will look at dielectrics (silicon nitride, silicon dioxide), semiconductors (polysilicon, epi silicon) and metals (refractory metals, refractory metal silicides, aluminum). There are many other important films (i.e., amorphous silicon for solar cells and TiN for tool harden-... [Pg.119]

Breck has reviewed the early literature where Ga3+, P5+, and Ge4 were potentially incorporated into a few zeolite structures via a primary synthesis route (2). Evidence has also been presented to show that the small amounts of Fe3+, typically present in both natural and synthetic zeolites, are located in framework tetrahedral positions (3). A more recent review of "isomorphic substitution" in zeolites, via primary synthesis methods, speculates on the potential Impact of such substitutions on catalysis (4). The vast majority of work has been related to the high silica zeolites, particularly of the ZSM-5 type. Another approach to substitution of metal atoms into the open frameworks of zeolite structures has been to replace the typical silica alumina gel with gels containing other metal atoms. This concept has resulted in numerous unique molecular sieve compositions containing aluminum and phosphorus 5 silicon, aluminum and phosphorus (6) and with... [Pg.420]

Transition metal carbides can be used as diffusion barriers like transition metal nitrides in multilayer metallization schemes for integrated circuits. Layers on the order of lOOnm are applied and are produced by sputtering methods. The high chemical stability of these transition metal carbides, especially those of group 4, are exploited to prevent interaction of metal or component layers such as silicon, aluminum, and silicides upon thermal load in production processes. This load would cause electrical or even structural deterioration of the multilayer packages. [Pg.602]

Diamond-coated tools are primarily used in the machining of nonferrous metals, alloys, and composite materials that are inherently very difficult to cut or machine. The range of materials that are suitable for machining by diamond-coated tools include aluminum and its alloys (in particular high-silicon aluminum alloys) magnesium audits alloys copper, lead, and manganese alloys graphite carbon plastics ... [Pg.390]

Table 6 shows the major metal oxides and the iron oxide impurity levels of typical borosilicate Type I glass. Up to 0.05% by weight (500 ppm) iron oxide as Fe O may exist in the borosilicate Type I glass. Thus, the increase in iron levels with time likely reflects a slow leaching of iron from the glass vial. Consistent with this explanation is that similar increases in silicon, aluminum, calcium, and barium levels are also observed in older product lots as shown in Table 6. Note that these nontransition metal ions are not known to participate in the type of reactions depicted in Figure 6. Furthermore, it is not clear if the expected increase in iron leaching from amber vials (Table 6) will be readily compensated for by the reduced light transmission at the causative wavelengths offered by utilizing the amber vial as the primary package. Table 6 shows the major metal oxides and the iron oxide impurity levels of typical borosilicate Type I glass. Up to 0.05% by weight (500 ppm) iron oxide as Fe O may exist in the borosilicate Type I glass. Thus, the increase in iron levels with time likely reflects a slow leaching of iron from the glass vial. Consistent with this explanation is that similar increases in silicon, aluminum, calcium, and barium levels are also observed in older product lots as shown in Table 6. Note that these nontransition metal ions are not known to participate in the type of reactions depicted in Figure 6. Furthermore, it is not clear if the expected increase in iron leaching from amber vials (Table 6) will be readily compensated for by the reduced light transmission at the causative wavelengths offered by utilizing the amber vial as the primary package.

See other pages where Silicon aluminum metal is mentioned: [Pg.352]    [Pg.719]    [Pg.352]    [Pg.719]    [Pg.320]    [Pg.205]    [Pg.42]    [Pg.379]    [Pg.395]    [Pg.97]    [Pg.153]    [Pg.164]    [Pg.180]    [Pg.22]    [Pg.166]    [Pg.684]    [Pg.22]    [Pg.203]    [Pg.580]    [Pg.41]    [Pg.241]    [Pg.256]    [Pg.259]    [Pg.937]    [Pg.495]    [Pg.279]    [Pg.17]    [Pg.274]    [Pg.321]    [Pg.205]    [Pg.205]    [Pg.446]    [Pg.25]    [Pg.495]    [Pg.167]   
See also in sourсe #XX -- [ Pg.8 , Pg.10 , Pg.53 ]

See also in sourсe #XX -- [ Pg.3 , Pg.5 , Pg.8 ]




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Aluminum metals

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Metallic silicon

Silicon-aluminum

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