Packaging sensor

Reliable packaging of chemical microsensors is a challenging task owing to the different requirements for the transducer part (freely accessible with medium or sample contact) and associated electronics (completely protected and shielded), so that only a few prototype packages have been presented so far [23,140]. 

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Figure 4-230 shows the photograph of a Develco high-temperature directional sensor. For all the sensor packages, calibration data taken at 25, 75, 125, 150, 175 and 200°C are provided. Computer modeling coefficients provide sensor accuracy of 0.001 G and 0.1° alignment from 0 to 175°C. From 175 to 200°C the sensor accuracy is 0.003 G and 0.1° alignment. 

Shocks along the borehole axis (sensor package axis) ... 

Figure 6.6 SeaDog sensor package configured for diver deployment.

Masserini, R. T., and Fanning, K. A. (2000). A sensor package for the simultaneous determination of nanomolar concentrations of nitrite, nitrate and ammonia in seawater by fluorescence detection. Mar. Chem. 68(4), 323—333. 

Cost considerations introduce additional restrictions. Sensor packaging can represent a substantial part of the total fabrication cost, being sometimes several orders of magnitude higher than the cost of the silicon part... 

From the packaging point of view new products have to be flexible to be applicable to varying customer requirements. Every automotive manufacturer will insist on his individual connector, or more general, his mechanical interface. The sensor packaging has to be able to meet these specific requirements in a flexible way, within the basic concept and without additional cost. 

Fig. 7.1.14 shows just a glimpse of the myriad of sensor packages. Package design standardization has been a problem with MEMS device commercialization. For accelerometers, standards are evolving more quickly because the devices can be de-... 

Fig. 7.1.14 Examples of automotive inertial sensor packages a) ADI s accelerometer in a header-style package and a SOIC-style package [8, 89, 97] b) an overmolded combination pressure and inertial sensor for Tire Pressure applications [90] c) the Bosch 2-chip PLCC 28-pin automotive accelerometer d) the...

Fig. 7.4.7 Cross section of sensor package for metal thin-film sensor used for gasoline direct injection...

Fig. 7.4.8 shows the results of endurance testing of a metal thin-film high-pressure sensor with the design shown in Fig. 7.4.7. Typical deviations from the ideal characteristic can be seen. The sensor has been tested in a gasoline direct injection car for 162000 km. The deviation is shown for pressures up to 140 bar and temperatures between —40 and 140 °C. Hysteresis can be seen for increasing and decreasing pressures at each measuring temperature. The maximum deviation of about 0.3% FSD demonstrates the long-term stability of the sensor package design and the thin-film technology.

Fig. 7.10.13 shows the crank-sensor package. It consists of a magnet, a molded integrated circuit (MIC) with terminals, and a resin case. An MIC integrating an MRE device and a wave-shaping circuit is inserted into a hollow-body magnet. The MIC with the hollow-body magnet is inserted into a resin cap. 

Electrochemical sensors are often used in an aqueous environment. Thus, the connection and insulation of the sensor are subjected to potential water penetration. This poses a critical challenge to the long-term operational life of the sensor, underscoring the importance of proper sensor packaging. 

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