Semiconductor applications silicon wafer analysis

AES is sufficiently mature and its application broad. Many general reviews of the technique deal with specific appHcations in general surface and thin film analysis. AES is often used to solve problems in metallurgy, plating, corrosion, and catalysis. Reviews covering these applications are listed in the Further Reading section. Because the primary electron beam can be focused down to a diameter of less than 10 nm, information about local compositions on a specimen s surface can be obtained. This special feature makes AES very attractive for applications in the semiconductor technology where submicrometer features are of interest. To satisfy semiconductor manufacturers, AES systems that are able to handle 300 mm silicon wafers are commercially available now. 

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