Sealants compliant seals

Bonded compliant seals Sealant bonds to adjacent pSOFC components and plastically deforms at room temperature and above... 

The joint region in compliant seals can be plastically deformed above room temperatures, which lessens the thermal stresses caused due to CTE mismatch. This category of sealants includes metallic components and hence is electrically conducting. In addition to this, the cell bowing and non-uniformities in the gas distribution are potential problems. Brazing and bonded compliant seals fall in this category and are discussed in Sects. 5.3.2.1 and 5.3.2.2. 

An advanced, absorbable, femoral sealing device has been developed for use in repairing femoral artery holes following angjoplasty. - The sealing component of the device is made of polyaxial, highly compliant, absorbable copolymer, similar to those described in Chapter 3 and proposed for use as transient sealants and vehicles for the controlled release of bioactive agents. 

Uses Adhesive/sealant resin for use in blown and cast film extrusion applies, incl. meat/poultry/seafood/cheese pkg., cereal liners, medical/ pharmaceutical pkg., powd./granularfood and non-food pouches, carded display/skin packaging films edible oil, motor oil, other li prod, pouches, snack structures coextrusions with nylon or in other film structures as heat seal or tie layer Features High clarity grade Regulatory FDA 21 CFR 177.1330 compliant Properties Melt flow 1.5 dg/min f.p. 78 C m.p. 103 C Vicat soften, pt. 81 C ultimate tens. str. 33.1 MPa (MD) ultimate elong. 450% (MD) Spencer impact str. 29 J/mm Dart drop str. 7.9 g/pm Elmendorf tear str. 46.3 mN/pm 9% methacrylic acid... 

In the same year, Weil et al. [13] introduced a sealing concept for planar SOFCs. The finite element method (FEM) was used to aid in scaling up a bonded compliant sealant design to a 120 x 120 mm component. The stresses of the cell, foil, brazes, and frame were calculated and compared with experimental fracture and yield stress results. A quarter symmetrical model was used. The commercial software AN SYS was utilized. The tensile stress of the component was predicted, considering thermal cycling from elevated temperature to room temperature. The materials used were mentioned, but no properties were given. Regarding the structural analysis boundary conditions and the failure criteria employed, material models were not depicted. 

---