Screen printing paste technology

Shin HY, Chung US. et al.. Effects of bonding materials in screen-printing paste on the field-emission properties of carbon nanotube cathodes. Journal of Vacuum Science and Technology B, 2005. 23(6) 2369-2372. 

In the early 1970s, the first companies to apply low cost, mass production techniques to photovoltaics, a technology that had previously been considered an exotic aerospace technology, emerged. These techniques included the use of electroplated and screen printed metal paste electrical conductors, reflow soldered ribbon interconnects, and by 1977, low cost, automobile windshield-style, laminated module constmction. Such processes benefitted from a substantial existing industrial infrastmcture, and have become virtually ubiquitous in the present PV industry. 

In the past, electron beam radiation was applied to produce PSA exclusively however, recent improvements in UV curing technology (precise UV dose control, suitable photoinitiators) permit UV to be used to produce pressure-sensitive adhesives. PSA formulations can vary in consistency from low-viscosity liquids up to solids melting at 80°C (176°F). Therefore, applications may vary from screen printing to roll coating to melt extrusion. Coat weights for most PSA materials vary from 1 to 10 g/m. ... 

Most electrochemical immunosensors use screen-printed electrodes produced by thick-film technology as transducers the importance of screen-printed electrodes in analytical chemistry is related to the interest for development of disposable and inexpensive immunosensors. A thick-film is based on the layers deposition of inks or pastes sequentially onto an insulating support or substrate the ink is forced through a screen onto a substrate and the open mesh pattern in the screen defines the pattern of the deposited ink. 

Bare die and other chip devices are attached with electrically conductive or nonconductive adhesives to ceramic substrates having defined circuit patterns produced by thin-film vapor deposition and photoetching of metals or by screen-printing and firing of thick-film pastes. With recent advancements in fine-line printed-circuit boards, adhesives are also finding use in attaching bare die to PWBs, a technology known as chip-on-board (COB). 

Surface mounting. Surface mounting of components onto PWBs is commonly referred to in the industry as SMT or surface-mount technology. It consists of the attachment of electronic components by automated dispensing or screen printing of solder paste and adhesive onto a PWB, placement of the components, then curing the adhesive and reflowing the... 

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