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Schottky process

The equilibrium thus established is a Frenkel defect. In both the Schottky and Frenkel equilibria, the stoichiometry of the crystal is unaltered (figure 4.2). Assuming that the thermodynamic activity of the various species obeys Raoult s law, thus corresponding to their molar concentrations (denoted hereafter by square brackets), the constant of the Schottky process is reduced to... [Pg.188]

An alternative way of calculating defect energies on the basis of static potentials is that outlined by Fumi and Tosi (1957) for alkali halides, in which the energy of the Schottky process is seen as an algebraic summation of three terms ... [Pg.195]

Generally, nevertheless, the defect concentration tendentially increases with T. Reexpressing the constant of the Schottky process as... [Pg.198]

To evaluate the energy of the Schottky process, based on the energies of table 4.2, the concomitant process of anion vacancy formation and the recombination energies of cation and anion on the surface of the crystal must be added to process 4.77.)... [Pg.209]

Whenever dilfusivity rates are not experimentally known and cannot be estimated by static potential calculations, approximate values can be obtained by empirical methods. The most popular of these methods establishes a linear relationship between the enthalpy of the Schottky process (and enthalpy of migration) and the melting temperature of the substance (expressed in K) ... [Pg.209]

Schottky mechanism Schott nomenclature Schradan [152-16-9] Schreibersite [12424-46-3] Schugi mixer Schulze-Hardy rule Schwann cells Schwarzembergite Schwenzfeier process Science policy... [Pg.872]

The second class of atomic manipulations, the perpendicular processes, involves transfer of an adsorbate atom or molecule from the STM tip to the surface or vice versa. The tip is moved toward the surface until the adsorption potential wells on the tip and the surface coalesce, with the result that the adsorbate, which was previously bound either to the tip or the surface, may now be considered to be bound to both. For successful transfer, one of the adsorbate bonds (either with the tip or with the surface, depending on the desired direction of transfer) must be broken. The fate of the adsorbate depends on the nature of its interaction with the tip and the surface, and the materials of the tip and surface. Directional adatom transfer is possible with the apphcation of suitable junction biases. Also, thermally-activated field evaporation of positive or negative ions over the Schottky barrier formed by lowering the potential energy outside a conductor (either the surface or the tip) by the apphcation of an electric field is possible. FIectromigration, the migration of minority elements (ie, impurities, defects) through the bulk soHd under the influence of current flow, is another process by which an atom may be moved between the surface and the tip of an STM. [Pg.204]

Metals for Schottl Contacts. Good Schottky contacts on semiconductor surfaces should not have any interaction with the semiconductor as is common in ohmic contacts. Schottky contacts have clean, abmpt metal—semiconductor interfaces that present rectifying contacts to electron or hole conduction. Schottky contacts are usuaHy not intentionaHy annealed, although in some circumstances the contacts need to be able to withstand high temperature processing and maintain good Schottky behavior. [Pg.383]

The results of several studies were interpreted by the Poole-Erenkel mechanism of field-assisted release of electrons from traps in the bulk of the oxide. In other studies, the Schottky mechanism of electron flow controlled by a thermionic emission over a field-lowered barrier at the counter electrode oxide interface was used to explain the conduction process. Some results suggested a space charge-limited conduction mechanism operates. The general lack of agreement between the results of various studies has been summari2ed (57). [Pg.331]

Fi.g 1 a—e. Charge transfer processes at pn-junctions (left side) and semiconductor-metal Schottky junctions (right side). [Pg.82]

The first process is due to Schottky barriers [30], which are electrical dipole moments that form at the metal I molecule interfaces, as discussed above [34,40]. The second process arises if the electrically-active portion of the molecule is placed asymmetrically within the metal I molecule I metal sandwich. This geometry is common, because a long alkyl tail is often needed to make the molecule amphiphilic so that it will form well-ordered Langmuir-Blodgett monolayers [76-78]. [Pg.52]

Despite the fact that not all details of the photographic process are completely understood, the overall mechanism for the production of the latent image is well known. Silver chloride, AgBr, crystallizes with the sodium chloride structure. While Schottky defects are the major structural point defect type present in most crystals with this structure, it is found that the silver halides, including AgBr, favor Frenkel defects (Fig. 2.5). [Pg.59]

An intrinsic defect is one that is in thermodynamic equilibrium in the crystal. This means that a population of these defects cannot be removed by any forms of physical or chemical processing. Schottky, Frenkel, and antisite defects are the best characterized intrinsic defects. A totally defect-free crystal, if warmed to a temperature that allows a certain degree of atom movement, will adjust to allow for the generation of intrinsic defects. The type of intrinsic defects that form will depend upon the relative formation energies of all of the possibilities. The defect with the lowest formation energy will be present in the greatest numbers. This can change with temperature. [Pg.77]


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