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Scanning vibrating electrode technique methods

Recently, two new electrochemical mapping techniques have become available the scanning vibrating electrode technique (SVET) and the localized electrochemical impedance spectroscopy (LEIS) technique. These techniques provide the capability to identify and monitor electrochemical behavior down to the micron level. These represent significant advances over traditional electrochemical methods (cyclic voltammetry, EIS, and even EQCM), which provide data that reflect only an average over the entire sample surface. Although such data are very useful, a major drawback is that no local or spatial information is obtained. [Pg.51]

As the nature of the electrified interface dominates the kinetics of corrosive reactions, it is most desirable to measure, e.g., the drop in electrical potential across the interface, even where the interface is buried beneath a polymer layer and is therefore not accessible for conventional electrochemical techniques. The scanning Kelvin probe (SKP), which measures in principle the Volta potential difference (or contact potential difference) between the sample and a sensing probe (which may consist of a sharp wire composed of a conducting, stable phase such as graphite or gold) by the vibrating condenser method, is the only technique which allows the measurement of such data and therefore aU modern models which deal with electrochemical de-adhesion reactions are based on such techniques [1-8]. Recently, it has been apphed mainly for the measurement of electrode potentials at polymer/metal interfaces, especially polymer-coated metals such as iron, zinc, and aluminum alloys [9-15]. The principal features of a scanning Kelvin probe for corrosion studies are shown in Fig. 31.1. [Pg.508]


See other pages where Scanning vibrating electrode technique methods is mentioned: [Pg.1379]    [Pg.1379]    [Pg.240]    [Pg.370]    [Pg.25]    [Pg.223]    [Pg.1610]    [Pg.573]    [Pg.662]    [Pg.451]    [Pg.85]    [Pg.709]    [Pg.888]    [Pg.558]    [Pg.129]    [Pg.454]    [Pg.218]    [Pg.442]    [Pg.187]   
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