Reworking electronic devices

The decision to rework electronic devices or assemblies depends on the cost of reworking versus the value of the part. Consumer electronics, due to their low cost, are considered throwaways and seldom reworked. For some, such as plastic-encapsulated microcircuits (PEMs) that are produced in high volumes, rework is impractical because of the difficulty in removing the plastic encapsulant without destroying the components. However, for high-value assemblies, such as densely populated PWBs and MCMs, where the final value may be as high as 10,000 or more, the ability to rework is essential. In such cases, rework may be necessary to meet schedules when small numbers of assemblies are produced. 

After the adhesive has been dispensed onto the PCBs or other interconnect substrate, bare die and other electronic components must be precisely placed. Of course, pick and place can be done manually using vacuum pick-up tools or tweezers, but this approach is useful only for small quantities, prototypes, or for rework. The risk of human error is high and accuracy is exacerbated as more and more very fine pitch devices are used. Even placing the device in the correct location, but in the wrong orientation can result in electrical failure. Manual placement is impractical for production quantities. 

Rework generally consists of removal and replacement of a failed electronic component that has been detected after initial electrical testing or testing after bum-in. The actual rework procedure is more of an art than a science. Since each component or assembly is different, considerable experience and care are required to selectively remove one device without damaging adjacent ones. 

Polymer adhesives have found their place in numerous electronics applications. Major uses include eommercial/consumer products computers and military, space, automotive, medical, and wireless communications. Some adhesives may be used aeross several applications while others have been formulated to meet applieation-specific requirements. For example, reworkability is not a consideration for high-production, low-cost consumer products such as cell phones or calculators, but is important for high-value, high-density printed-wiring boards (PWBs) used in military and spaee electronics. Further, thermal stability at high temperatures is required for near-engine electronics in automobiles, aircraft, and for deep-well sensors, but not for office computers. The major applications for polymer adhesives are to attach and electrically insulate or to electrically connect components, devices, connectors, cables, and heat sinks to printed-circuit boards or to thin- or thick-film hybrid microcircuits. In addition, over the last several decades, new uses for adhesives have emerged for optoelectronic (OE) assemblies, microelectromechanical systems (MEMS), and flat-panel displays. 

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