Pyromellitic acid dianhydride-oxydiamine

Ea, above and below Tg. Three case studies illustrate the range of applicability of the bending beam setup and factors contributing to the stress state. The first is a comparison of two polymers for interlayer dielectrics PMDA-ODA (pyromellitic acid dianhydride - oxydiamine) and a bis-benzocyclobutene. The second is of a neat epoxy resin commonly used for microelectronics encapsulation (epoxidized ortho-cresol novolac cured with a phenolic novolac). The third is a screen-printable polyimide coating used for protection of the integrated-circuit chip. An outline of our stress model is sketched, and example results are presented. 

PMDA-QDA and BCB. Stresses induced during processing of a PMDA-ODA polyimide (pyromellitic acid dianhydride -oxydiamine, Dupont Pyralin 2545) and a bis-benzocyclobutene (BCB, Dow proprietary) were studied using the bending beam apparatus. Both materials were used as supplied by the manufacturer the PMDA-ODA solvated in n-methyl pyrrolidinone and the BCB in xylene. Final coating thicknesses, as measured by profilometry, were 2.8 xm for the PMDA-ODA and 3.2 xm for the BCB on fused quartz strips. 

---