Process parameters composite plating

The deposition variables are the process parameters most suited to regulate the particle composite content within the limits set by the particle properties and plating bath composition. Particle bath concentration is the most obvious process variable to control particle codeposition. Within the limits set by the metal plating process and the practical feasibility also current density, bath agitation and temperature can be used to obtain a particular composite. Consequently the deposition process variables are the most extensively investigated parameters in composite plating. The models and mechanisms discussed in Section IV almost exclusively try to explain and model the relation between these process parameters and the particle codeposition rate. 

Composites are deposited using both electroless62-64 and electrolytic plating processes. In the latter case composite deposition occurs in the presence of an applied electrical field, which is characterized by the cathodic potential or current density. The current density is the most extensively investigated process parameter. Roughly two types of current density dependencies can be distinguished. The particle composite content against current density curve either decreases or increases continuously or exhibits one or two... 

It can be seen that the main process parameters which affect the throwing power are the composition of the plating bath (i.e. total electrolyte concentration, complexing agents, pH, additives), temperature and current density. 

Bulasara, V. K., Thakuria, H., Uppaluri, R., Purkait, M. K. (2011). Effect of process parameters on electroless plating and nickel-ceramic composite membrane characteristics. Desalination, 268(1), 195—203. 

There are three important constituents of a solder joint the two materials or surfaces to be joined and the solder itself Each has its own set of attributes and variables that contribute to the ease and quality of soldering. A delicate balance of material conditions and process parameters determine the solder joint appearance, resultant strength, and reliabihty of the soldered assembly. The composition of the solder, the surface finish on lead, pad or plated through-hole (PTH), environmental factors, chemical implications, and thermal conditions aU impact the soldering process. Each will be discussed. 

As a further step towards the optimization of the coating process, the influence of the operational variables on the final composite mechanical properties was studied. Four different parameters (polymer powder size, fiber pull speed, and furnace and PCT die temperatures) were independently varied. Then towpregs were produced under preset conditions, and composite plates were obtained by compression molding and subjected to mechanical testing (three-point bending and tensile tests). The overall results are summarized in Table 3. 

Electrodeposition of metal onto structured objects, such as circuits, is controlled in part by a template. At the same time, the deposit must fill all the recesses uniformly and seamlessly, the texture and crystal structure must fall within tolerances, and the quality of the features must be sustained over a large workpiece. The distribution of material within recesses or onto widely separated portions of the workpiece is subject to a limited number of macroscopic control-parameters such as applied potential and plating bath composition. Success therefore depends on exploitation of the natural pathways of the process. The spontaneous and unconstrained development of structure must be taken into consideration in the production of highly organized and functional patterns. 

B show the model and pilot plant predictions respectively. Figure 12.6 clearly shows that there are large process-model mismatches in the composition profiles although for a given batch time of tdiS = 220 min the amount of distillate achieved by the experiment was the same as that obtained by the simulation. These process-model mismatches can be attributed to factors such as use of constant Vmodei instead of a dynamic one constant relative volatility parameter used in the model and uncertainties associated with it actual efficiency of the plates. 

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