Printed wiring boards, use

Figure 1. Fabrication process of printed wiring boards using PTFE substrates.

R. Enomoto, et al., Advanced Full-Additive Printed Wiring Boards Using Heat Resistant Adhesive, PC World ConfV, Paper No. B6-1, Glasgow, Scotland, June 1990. 

Ch oline in the form of choline base (hydroxide) is a strong organic base with a pH of approximately 14. This product can have industrial apphcations where it is important to replace inorganic bases with organic materials. Ch oline base is currently used in the formulation of photoresist stripping products for use in the printed wire board industry. Dilute aqueous solutions (5%) of ch oline base that have very low concentrations of metallic ions have been utilized for apphcations in the semiconductor industry. 

Silicon—Ca.rbon Thermoset. The Sycar resins of Hercules are sihcon—carbon thermosets cured through the hydrosilation of sihcon hydride and sihcon vinyl groups with a trace amount of platinum catalyst. The material is a fast-cure system (<15 min at 180°C) and shows low moisture absorption that outperforms conventional thermosets such as polyimides and epoxies. Furthermore, the Sycar material provides excellent mechanical and physical properties used in printed wiring board (PWB) laminates and encapsulants such as flow coatable or glob-top coating of chip-on-board type apphcations. 

Manufacture of Printed Wiring Boards. Printed wiring boards, or printed circuit boards, are usually thin flat panels than contain one or multiple layers of thin copper patterns that interconnect the various electronic components (e.g. integrated circuit chips, connectors, resistors) that are attached to the boards. These panels are present in almost every consumer electronic product and automobile sold today. The various photopolymer products used to manufacture the printed wiring boards include film resists, electroless plating resists (23), liquid resists, electrodeposited resists (24), solder masks (25), laser exposed photoresists (26), flexible photoimageable permanent coatings (27) and polyimide interlayer insulator films (28). Another new use of photopolymer chemistry is the selective formation of conductive patterns in polymers (29). 

Many of the fabrication processes for integrated circuits are similar or conceptually related to those used in the manufacture of printed wiring boards. However, because of the extremely fine device features, fabrication must be carried out in clean rooms having strictly controlled environments. Particulate and chemical contamination are minimized, and temperature, humidity, and even vibration are carefully controlled. 

Brominated epoxy resins are the reaction product of epichlorohydrin and brominated bisphenol A. They are primarily used in applications where ignition resistance is a requirement, such as printed-circuit boards and other products that need to be flame-retardant. Tetrabromobisphenol A is the largest flame retardant in terms of commercial use at present. It is used in an estimated 95 percent of all flame-retardant printed wiring boards and is used in many flame-retardant surface-mounted adhesives.2 It is manufactured by several producers and is priced as a commodity product. 

Perfluoropolyimides (IV) prepared by Ando [4] were useful as optical waveguide circuits for printed wire-board interconnections. 

Figure 4 shows an example of a pin grid array (PGA), developed to accommodate IC s with 84 or more pins. The original PGA s were ceramic packages, but several techniques are now used to produce them in plastic. The PGA s can be through-hole mounted on the printed wiring board, or can be socketed and surface mounted. 

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