Polymer metal-containing, plasma

The results of tensile lap-shear and chemical composition tests for different process schemes are shown in Tables 21.2-21.4. Metal analyses of the initial plasma coating layer and those of the failed surfaces after tensile lap-shear tests confirm that the failure occurred at the interface between the substrate surface and the bottom of the plasma polymer film. These results show that the intermediate layer provided by grading of the metal content throughout the plasma polymer film can improve the strength between the polymer and metal films. The graded metal-containing plasma polymer film can join a polymer and a metal with strong adhesion, and also reduce... 

Formerly, Bradley and Hammes [152] studied dc conductivity phenomma on a number of metal-free and some metal-containing plasma polymers. They foimd plots of Igdc resistivity versus 1/T to be generally linear and concluded that a single activation process is responsible, with activation energies of 1.36 eV for metal-free polymers and < 1 eV for metal-doped polymers. For evaporated Cu/poly-ethylene films [129] the Ig sheet resistance revealed a linear dependence on The conduction process was explained in terms of hopping of electrons between traps in localized states dose to the Fermi level. 

Unexpected elements in a plasma polymer often are due to the redeposition of ablated materials. The presence of nitrogen found in a plasma polymer of a monomer that does not contain nitrogen can be traced to contamination of the reactor, which has been used for plasma polymerization of nitrogen-containing monomers [1]. The ablation of electrode material has been utilized to create a graded metal-polymer and polymer-metal interfaces to obtain an excellent adhesion [2,3]. Ablation, therefore, could be utilized in a beneficial way in the engineering of interfaces if we know the nature of ablation and how to control it. 

It seems likely that the Involvement of (CF2)n species Is also prominent In the plasma polymerization of the other fluorocarbons of F/C52. In a subsequent paper (30) we shall demonstrate that this Is Indeed the case. In an Investigation of metal containing polymers produced In plasmas excited In the series of perfluoroalkanes CjjF2n+2 >3,4). ... 

The technology of plasma formation of metal-containing polymers in the form of thin films dates from 1963, when Bradley and Hammes(15) prepared specimens from some forty different materials, and studied their electrical conductivities. Included in the study were organic compounds of iron, tin, titanium, mercury, selenium, and arsenic. The presence of a metal or transition element in the polymer did not lead to special electrical properties compared to the purely organic polymers studied. 

Composite films are those containing two or more phases. Composite films often will be deposited in reactive deposition processes if there is not enough reactive gas available or if there is a mixture of reactive gases. The properties of composite films depend not only on the composition but the size and distribution of the separate phases. Metals may be co-deposited with polymers to form a polymer-metal composite film. This can be done by combining physical sputtering with plasma polymerization,... 

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