Polymer-encapsulated substrates

Structure EANPS = electrostatic agglomerated nonporous substrate, EAWPS = electrostatic agglomerated wide-pore substrate, PGPS = polymer grafted porous substrate, SMPSS = silane modified porous silica substrate, CMS = chemically modified substrate, APCS = adsorbed polymer-coated substrate, PES = polymer-encapsulated substrate. 

For example, in an investigation of silanes as adhesion promoters for ethylene/ vinyl acetate co-polymer encapsulants reported by Koenig et aL, the organo-silanes (referred to as primers ) were shown to generate primary chemical bonds at the polymer/substrate interface [27]. 

A number of integrated circuit (IC) failure mechanisms are related to the presence of water and impurities at device surfaces. The most catastrophic failures are open or short circuits resulting from electrochemical attack on substrate metallization. Other, more subtle maladies include increased capacitive coupling between conductors (1.), reduced bipolar current gain (2), shifted MOS threshold voltages (3.4), and parasitic MOS devices (5.6). These problems arise from spurious electrical conduction processes in the presence of moisture and ionic contaminants. Polymer encapsulants, such as silicone rubber, provide barriers that prevent the formation of conductive water films on IC surfaces. 

Supported catalysts involving palladium on carbon and dendrimer-encapsulated palladium and a polymer-supported phosphine palladium catalyst have facilitated C-C coupling reactions in SCCO2. Polymer-tethered substrates or amine bases have also been successfully used for the Mizoroki-Heck and Suzuki-Miyaura reactions in SCCO2. For example, REM resin underwent a Mizoroki-Heck reaction with iodobenzene to yield, after cleavage, ( )-methyl cinnamate 48 (74%) (Scheme 88). It is assumed that SCCO2 acts as a good solvent that swells the polymers and exposes reactive sites. 

Fig. 16.10 Size dependence of the core-level shift of Au, Pd, Cu, and CuO nanocrystals, a Au [70] encapsulated in Thiol and Au on Octan [32] show three-dimensional features while Au on Ti02 [33] and on Pt [34] show plate pattern of formation, b Pd on HOPG substrate [35]. The different m values in c of Cu on HOPG and CYCL [31] indicate the contribution from the reaction between Cu nanosolid and polymer CYCL substrate, d Core-level shift and bandwidth of CuO nanoparticles (Reprinted with permission from [3])...

The surface energy of silicones, the liquid nature of the silicone polymers, the mechanical properties of the filled networks, the relative insensitivity to temperature variations from well below zero to very high, and the inherent or added reactivity towards specific substrates, are among the properties that have contributed to the success of silicone materials as adhesives, sealants, coatings, encapsulants, etc. 

Transition-metal nanopartides are of fundamental interest and technological importance because of their applications to catalysis [22,104-107]. Synthetic routes to metal nanopartides include evaporation and condensation, and chemical or electrochemical reduction of metal salts in the presence of stabilizers [104,105,108-110]. The purpose of the stabilizers, which include polymers, ligands, and surfactants, is to control particle size and prevent agglomeration. However, stabilizers also passivate cluster surfaces. For some applications, such as catalysis, it is desirable to prepare small, stable, but not-fully-passivated, particles so that substrates can access the encapsulated clusters. Another promising method for preparing clusters and colloids involves the use of templates, such as reverse micelles [111,112] and porous membranes [106,113,114]. However, even this approach results in at least partial passivation and mass transfer limitations unless the template is removed. Unfortunately, removal of the template may re-... 

Recently, Caster et al. described the surface modification of multifilament fibers such as nylon or Kevlar [70]. Coating techniques using preformed ROMP-based polymers and process contact metathesis polymerization (CMP), initially described by Grubbs et al. [71], were both used. The latter involves a procedure where the initiator is physisorbed onto the surface of a substrate and fed with a ROMP-active monomer that finally encapsulates the substrate. These modified fibers showed improved adhesion to natural rubber elastomers. 

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