Pattern Effects on Planarization Efficiency of Cu Electropolishing

Cu electropolishing technology has been explored as a replacement of the Cu CMP planarization process. Contolini et al. (1994) integrated Cu 

FIGURE 4.18 Basic process of Cu electrochemical planarization technology. 

FIGURE 4.19 SEM cross-sectional profile of a lO-pm Cu line planarized by the ECP process. 

FIGURE 4.20 Tafel plots of Cu electroplating with various electrolytes. 

FIGURE 4.21 Potentiodynamic curve of Cu electropolishing. In addition, the optical microscope images (200x) show surface morphologies of Cu electropolished at different applied voltages. 

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