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Packaging memory

Packaging memory, of sutures, 24 215 Pack carburizing, case hardening by,... [Pg.667]

I. 14) which is about two-fold less than equivalent size nylon (Dermalon)-and PP (Surgilene)-based monofilament sutures. The elastomeric characteristic of polybutester block copolymer also renders Novafil less susceptible to package memory than PP and nylon-based monofilament sutures. [Pg.297]

Key words absorbable, nonabsorbable, tensUe strength, knot strength, elasticity, packaging memory, biodegradabiUty, suture compUance, tissue reaction, pliabiUty, wound closure biomaterials, sutures. [Pg.415]

Packaging memory, which should be minimum for easy handling. [Pg.421]

Importantly for direct dynamics calculations, analytic gradients for MCSCF methods [124-126] are available in many standard quantum chemistiy packages. This is a big advantage as numerical gradients require many evaluations of the wave function. The evaluation of the non-Hellmann-Feynman forces is the major effort, and requires the solution of what are termed the coupled-perturbed MCSCF (CP-MCSCF) equations. The large memory requirements of these equations can be bypassed if a direct method is used [233]. Modem computer architectures and codes then make the evaluation of first and second derivatives relatively straightforward in this theoretical framework. [Pg.301]

The radiation-treated cables find wide applications in control instmmentation of nuclear power reactors, particle accelerators, aviation, and telephone equipments. Usually PE and PVC are radiation cross-linked for production of such cables. The heat shrinkable foils are widely used in packaging, electrical and electronic industries. The radiation cross-linked PE possesses the property of elastic memory which is utilized to produce heat shrinkable products. [Pg.874]

The Atari ST was chosen because it has a high performance graphics engine, an advanced operating system, and a large amount of easily accessible memory. These features make it an excellent value for the money. The IBM PC may be the computer of choice for business packages, but it has less technical and cost justification when used to run custom software. [Pg.11]


See other pages where Packaging memory is mentioned: [Pg.153]    [Pg.410]    [Pg.153]    [Pg.452]    [Pg.286]    [Pg.424]    [Pg.425]    [Pg.689]    [Pg.66]    [Pg.1369]    [Pg.241]    [Pg.242]    [Pg.286]    [Pg.153]    [Pg.410]    [Pg.153]    [Pg.452]    [Pg.286]    [Pg.424]    [Pg.425]    [Pg.689]    [Pg.66]    [Pg.1369]    [Pg.241]    [Pg.242]    [Pg.286]    [Pg.571]    [Pg.274]    [Pg.130]    [Pg.206]    [Pg.529]    [Pg.265]    [Pg.349]    [Pg.188]    [Pg.1980]    [Pg.231]    [Pg.688]    [Pg.245]    [Pg.532]    [Pg.632]    [Pg.929]    [Pg.422]    [Pg.5]    [Pg.279]    [Pg.106]    [Pg.308]    [Pg.108]    [Pg.5]    [Pg.8]    [Pg.197]    [Pg.166]    [Pg.265]   


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Memory Modules and Vertical-Stack Packaging

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