Package and test

A final approach to avoid stiction effects is to apply a self-assembled monolayer (SAM) that is hydrophobic as a part of the release process. This process forms a hydrophobic Teflon-like coating on the contacting surfaces that reduces the capillary forces decreasing stiction effects [2]. 

After the parts have been released they can be inspected to determine whether or not the release went well. If parts have not been properly anchored the die can look like a battleground with debris distributed over it. A good design practice is to include test structures in addition to the parts to assess the success of the release step. Common test structures 

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Opening the packages and testing for package integrity and changes in food color, flavor, odor, or taste. 

One of the purposes of the pilot production batch is to introduce the new product in its entirety to the functional areas of the site (manufacturing, packaging, and testing), that is, the release of raw materials and packaging components as well as in-process, bulk, and finished product testing should be completed at the site as if the pilot scale-up were a commercial batch. 

To assemble and review all documentation relating to the processing, packaging and testing of each batch of finished product before authorizing release for sale. 

Principles The principal [manufacturer] carries final responsibility that the product has been manufactured, packaged and tested according to effective GMP Guidelines. 

Manufacturing, packaging and testing records and samples must be kept on file by the principal. 

MEPTEC Microelectronics Packaging and Test Engineering Council... 

In response to Congress, a second NRC committee, the Committee on Review and Evaluation of Alternative Technologies for Demilitarization of Assembled Chemical Weapons Phase II (ACW II committee), was formed and tasked to produce three reports (1) an evaluation of the Demo II tests (Task 1), (2) an evaluation of two engineering design studies (EDSs) and tests for use at the Pueblo, Colorado, storage site (Task 2), and (3) an evaluation of EDS packages and tests for the Blue Grass, Kentucky, site (Task 3). 

Receive technical briefings from AEA and Foster Wheeler/Eco Logic/Kvaemer on their proposed EDS packages and testing schedules for EDS II. Receive briefings from ACWA technical team concerning EDS II schedules and reviews. 

MEPTEC (Microelectronics Packaging and Test Engineering Council) is a trade association of semiconductor suppliers and manufacturers, committed to enhancing the competitiveness of the back-end portion of the semiconductor business. This organization provides a forum for semiconductor packaging and test professionals to learn and exchange ideas that relate to assembly, test, and handling. It was founded over 25 years ago. 

Michael Huff and Martin A Schmidt, "Fabricaton, Packaging and Testing of a Wafer-Bonded Microvalve", Digest Workshop Hilton Head 1992, pp 194-197... 

Preapproval inspection (PAI) An inspection by the FDA of the facilities that are proposed as the manufacturing, packaging, and testing sites in the NDA. The PAI normally occurs during the review process. Besides inspecting the facilities, the documentation will be reviewed for compliance to GMPs, SOPs and to verify the integrity of the data in the submission. 

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