Other Anhydride Curing Agents

Other latent curing agents that are used in solid adhesives are dihydrazides and BF3-MEA complexes. These compositions are also stable at room temperature but cure when heated. Solid anhydrides can be used in one-component powder blends (e.g., 10 pph of trimellitic anhydride accelerated with 0.5 pph of 2-methylimidazole). Solid systems with aromatic diamines are prepared by comelting the solid epoxy with the amine. Typically 30 pph of curing agent is used.1... 

Phthalic anhydride is the cheapest anhydride curing agent, but it has the disadvantage of being rather difhcult to mix with the resin. Liquid anhydrides (e.g., dodecenylsuccinic anhydride and nadic methyl anhydride), low-melting anhydrides (e.g., hexahydrophthalic anhydride), and eutectic mixtures are more easily incorporated into the resin. Since maleic anhydride produces brittle products, it is seldom used by itself and is used as a secondary hardener in admixture with other anhydrides. Dodecenylsuccinic anhydride imparts flexibility into the casting, whereas chlorendic anhydride confers flame resistance. 

Copper surfaces may be stuck with urea formaldehyde resins or, if these are too brittle to suit the application, they may be used as a priming coat above which some other adhesive is applied. Epoxy resins vary in their behaviour towards copper owing to differences in the curing agent employed. Anhydride curing agents are known to be... 

Crosslinking of epoxy plastics through the hydroxyl groups of the repeat unit is used for prepolymers with low epoxide group contents. The most common curing agent is phthalic anhydride although other acid anhydrides such as tetrahydrophthalic, nadic methyl, and chloroendic anhydrides are used in specialty applications ... 

After the primary amines, acid anhydrides are the next most important class of epoxy curing agents, although these are not used as often in adhesive systems as they are in casting compounds, encapsulants, molding compounds, etc. The most common types of anhydrides are hexahydrophthalic anhydride (HHPA), phthalic anhydride (PA), nadic methyl anhydride (NMA), and pyromellitic dianhydride (PMDA), although there are several others. Chemical structures of several anhydrides are illustrated in Fig. 5.6. 

Benzyldimethylamine (BDMA) is another tertiary amine that can be used as either a sole catalyst or an accelerator with other curing agents. It is used with DGEBA epoxy resins at 6 to 10 pph. The pot life is generally 1 to 4 h, and the cure will be complete in about 6 days at room temperature. When used by itself, BDMA can provide epoxy adhesive formulations with high-temperature resistance (Chap. 15). However, BDMA is mostly used as an accelerator for anhydride and dicyandiamide cured epoxy resins. 

Whereas most room temperature curing epoxy adhesives are cured with aliphatic amines, polyamides, or amidoamines, most elevated-temperature curing epoxy adhesives are cured with aromatic amines, modified aliphatic amines, alcoholic and phenolic hydroxyls, acid anhydrides, Lewis acids, and a host of other curatives. Latent curing agents, such as dicyan-diamide and imidazoles, are typically used in one-component epoxy adhesives systems. 

There are two options for the other component of an epoxy resin system. Use of mono- or di-anhydrides as curing agents, usually catalyzed by a tertiary amine, causes reactions with the residual secondary hydroxyls in the repeating unit of the prepolymer forming esters and free carboxylic acids. The carboxylic acids formed also react with the epoxide end groups forming cross-links and further free secondary hydroxyl groups. Maleic anhydride, phthalic anhydride, or pyromellitic dianhydride are suitable for this process (Eq. 21.27). 

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