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No-flow underfill

SMT adhesives, solder pastes, conductive epoxies, solder masks, and no-flow underfill materials SMT adhesives, solder pastes, conductive epoxies, solder masks, and no-flow underfill materials... [Pg.191]

In addition to capillary-flow underfilling, a new approach to underfilling has been developed whereby the underfill material is applied before attaching the flip-chip or BGA device. Specially formulated adhesives, known as no-flow underfills (NFU) or... [Pg.226]

Once cured, the properties of NFUs are similar to those of capillary-flow underfills. One major difference is that the no-flow materials are generally unfilled and, as a result, their expansion coefficients are higher than those of their filled counterparts. However, their lower moduli more than compensate for the mismatches in expansion coefficients. NFU adhesives have shorter shelf lives than capillary-flow types because of the incorporation of the fluxing agent into the adhesive formulation. Table 5.4 is a compilation of underfills and their properties while Table 5.5 lists examples of capillary flow and no-flow underfills and their applications. [Pg.233]

Table 5.5 Examples of capillaiy-flow and no-flow underfill adhesives and applications... [Pg.236]

Li Z, Lee S, Lewis B, Houston P, Baldwin D, Stout E, Tessier T, Evans J. No flow underfill assembly process development for fine pitch flip chip silicon to silicon wafer level integration. Advancing Microelectronics. July/August 2010 20-25. [Pg.286]

DeBarros T, Katze D. Achieving SMT compatible flip-chip assembly with no-flow underfills. Proc. NEPCON West Conf Anaheim, CA 2000. [Pg.286]

No-flow underfill Epoxy resin 40-70% Epoxy curing agent 15 0% Hydrogenated bisphenol-A 7-13% 3MUF-3400... [Pg.141]

MicroMax / GPD Global 12 X 12 2.25 True Value Pump/ servo-driven valve/36,000 SMT adhesive, conductive epoxies, no-flow underflll (unheated), hybrid assembly, small-dot dispensing SMT Adhesives Amicon D125F, 125FDR, Loctite Chipbonder 3615 (red), Dymax 9-20367 (red) and 9-20368 (yeUow), Amicon E7650, 7652, conductive epoxies Ablebond 84-1 LMl, no-flow underfill Amicon E1330 LV, 1350, and 1355. [Pg.235]

Table 5.5. Examples of Capillary-flow and No-flow Underfill Adhesives and Applications... [Pg.291]

Loctite 3594/ Loctite Fluxing (no-flow) underfill NA Device passivations, OSP - copper, copper-nickel-gold Automated pattern dispense Flip-chip-on-board using SMT reflow profiles. Suitable for high-fi-equency applications ( - 2.9 at 100 kHz). [Pg.294]

DeBarros, T., and Katze, D., Achieving SMT Compatible Flip-Chip Assembly with No-Flow Underfills, Proc. NEPCON West Conf., Anaheim, CA (2000)... [Pg.344]

Study on Metal Chelates as Catalysts of Epoxy and Anhydride Cure Reactions for No-Flow Underfill Applications... [Pg.264]

See other pages where No-flow underfill is mentioned: [Pg.217]    [Pg.226]    [Pg.233]    [Pg.459]    [Pg.282]    [Pg.285]    [Pg.437]    [Pg.57]    [Pg.284]    [Pg.287]    [Pg.439]    [Pg.265]    [Pg.268]    [Pg.269]    [Pg.276]    [Pg.277]    [Pg.106]    [Pg.189]    [Pg.163]    [Pg.303]   
See also in sourсe #XX -- [ Pg.163 ]



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No-flow underfills

Underfills

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