Ni-Sn system

CuioSn3, and Cu6Sn5 (Villars and Calvert, 1991,1997) exist, no binary nickel and copper plumbides are known. This fact is transferred to the ternary R-Ni(Cu)-Pb systems. The plumbides systems contain fewer ternary compounds when compared to the stannide ones. To give an example, 15 stannides have been reported for the Gd-Ni-Sn system (Skolozdra, 1997), while only five plumbides exist in the related system with lead (Gulay, 2003b). This empirical rule is observed for many other ternary systems. 

In the case of the Ni/Sn system, data also exists for all three low index faces, forming c(2x2) 0.5 ML surface alloy phases on both Ni(lOO) and Ni(l 10), while on Pt(l(X)) there are also data for a c(2x2)-Sn surface alloy, so these systems allow a rather different comparison of mmpling amplitudes, shown in Table 5. Notice that on all these surfaces the Sn atoms must replace Ni or Pt atoms which, at least in one direction within the surface, are separated by their nearest-neighbour distance of twice their metallic radius. A simple... 

Four ternary compounds in the Sc-Ni-Sn system have been synthesized and structurally investigated (table 21). However, there are only few data known about the phase equilibria. Kotur and Klyuchka (1989) reported that at 400°C the ScNi4Sn stannide is in equilibria with Ni and ScNi2Sn. The latter compound is also in equilibrium with ScNiSn. Derkach and Kotur (1994) also foxmd that at 400°C the Sc2Ni2Sn ternary compoxmd is in equilibria with the ternary phase ScNiSn and also with the binary phases ScNi2, ScNi and ScsSns. 

Fig. 2. Isothermal section of the Ce-Ni-Sn system at 670 K (1) CeNisSn (2) CeNi4Sn2 (3) CeNi2Snj (4) Ce9Ni24Sn4, (5) CcjNijSn, (6) CeNii.jSnj., (7) Ce NiSoj (8) CeNiSn (9) CejNijSn (10) CejNiisSni.j...

The Lu-Ni-Sn system has been investigated at 770 K (up to 50 a/c Sn) and 670 K (more than 50 a/c Sn) (Skolozdra and Komarovskaya 1988b). The authors have found four more compounds in the Lu-Ni binary system in addition to the known ones, and in the Lu-Sn system they have found the Lu5Sn4 compound. 

From this point of view Skolozdra (1993) has made an explanation for the larger number of compounds in the R-Ni-Sn systems in comparison with the R-Fe-Sn and the R-Co-Sn systems. 

While both the Cu-Sn and Ni-Sn phase diagrams have been well characterized, only sections of the ternary phase diagram of the Cu-Ni-Sn system are available at 235 °C (455 F) (Ref 33,49) and 240 °C (464 T) (Ref 50, 51), based on experimental data and thermodynamic modeling. The version of the diagram from Ref 50 is presented as Fig. 3. It is seen that the (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4 compounds are... 

Schaefer, M. Foumelle, R.A. Liang, J.J. Theory for intermetallic phase growth between Cu and liquid Sn-Pb solder based on grain boundary diffusion control. J. Electron. Mater. 1998, 27, 1167. Gur, D. Bamberger, M. Reactive isothermal solidification in the Ni-Sn system. Acta Metall. Mater. 1998, 46 (14), 4917-4923. 

The reaction front typically grows well beyond the voids so they become imbedded in the reaction product. As was the case for impurity snowplowing, the greater the amount of reaction product, the greater the void volume. Fig. 35 depicts Kirkendall voids that formed in the Ni-Sn system with a high-Sn, lead-free solder. The unreacted Ni is void-free, while there are numerous voids in the Ni3 n4 reaction product. These voids usually form close to a reaction interface, reducing the interfacial area but not necessarily the interfadal strength. Fig. 32 shows the effect of the voids on the properties of intermetallic compounds. The cross-sectional area of the intermetallics is reduced and the presence of voids results in a stress concentration at void surfaces [116]. For a spherical void, the stress concentration factor is typically three times the nominal stress. 

Ni-Sn (250,251). In many respects this system is very similar to the Ni-Cu system. 

Cells which are particularly convenient for work with mercury pool cathodes for both batch and continuous electrolysis were designed by Coleman and Wagenknecht12) and shown in Fig. 3 and 4. In the batch cell (Fig. 3), the mercury placed at the bottom of a cylinder serves as the cathode and the anode is suspended above it in parallel. For experiments in a divided cell the anode is enclosed in a smaller cylinder (also suspended from the top) which serves as the anode compartment. In the continuous electrolysis cell (Fig. 4), the solution was circulated through the system by means of a pump. A repeat-cycle timer device was used to control the addition of reactant and the recovery of products. Anodes of various materials were used (Pt, graphite, platinized C, Ni, Sn, steel and DSA), but the nature of the anode did not seem to affect the reaction. 

There is a distinct difference for these fifteen plumbide systems when compared with the stannide systems (Skolozdra, 1997). This difference becomes already evident when looking at the binary Ni-Sn(Pb) and Cu-Sn(Pb) systems (Massalski, 1986). While binary stannides like NigSn, Ni3Sn2/ NiSn, Ni3Sn4, Cu3Sn,... 

Duplex structures are also formed in reaction couples of the type ApBq AiBn. In the Ni-Sn binary system, such a structure is typical of the Ni3Sn2 layer occurring between the Ni3Sn and Ni3Sn4 phases. In the Ni3Sn2 lattice, nickel atoms diffuse much faster than tin atoms. Therefore, the Ni3Sn2 layer grows mainly by means of the reaction... 

Cocco et al. [54] discuss the preparation of metallic glass, while copper-titanium, aluminum-titanium, and palladium-titanium systems in particular are prepared under a controlled atmosphere with hydrogen and argon. Components of Nb-Ni and Nb-Y have also been described [55]. Amorphous Ni-Ti alloys have been prepared by Schwarz et al. [56], while Ni-Ga, Ni-Ge, Ni-In, and Ni-Sn has been synthesized in supersaturated solid solutions [57]. Fe, Co, Ni-Ta-alloys are described by Lee and Yang [58], while FeSi2 doped with Co or Al for thermoelectric material is also mentioned [59]. 

Other Cu-based alloys Dealloying phenomena have also been discussed for Cu alloys from the Cu—Ni, Cu—Mn, and Cu—Sn systems [45, 84, 85]. In the case of long-term corrosion of Sn-bronze (a-Cu—Sn) in natural environments, which is obscured by complex patina formation, it has been shown that the relevant dealloying process is decuprification rather than destannification (as formerly assumed). 

Hoc] Hoch, M., Application of the Hoch-Arpshofen Model to the Thermodynamics of flie Cu-Ni-Sn, Cu-Fe-Ni, Cu-Mg-Al and Cu-Mg-Zn Systems , Calphad, 11(3), 237-246... 

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