National Electronics Manufacturing Initiative

The National Electronics Manufacturers Initiative (iNEMI) has a technical feasibility study in progress on flame-retardants used in PWB.105... [Pg.695]

NEMI-2000 Edition, National Electronics Manufacturing Technology Roadmaps , National Electronics Manufacturing Initiative (NEMI), Inc, Virginia, US... [Pg.336]

In spite of a tremendous amount of effort for the search of lead-free C4s, no industry standard has evolved as yet. Commonly cited lead-free solders are Sn-rich alloys for which electroplating processes are available. The most popular lead-free solder among them is Sn3.9AgO.6Cu with a melting temperature of 217°C. This solder is recommended by National Electronic Manufacturing Initiative (NEMI) and has been extensively studied and characterized by NIST. However, applicability of this solder as a C4 material in chips with advanced ILD is not known. [Pg.233]

National Electronics Manufacturers Initiative Roadmap, 1998. www.inemi.org... [Pg.203]

The National Electronics Manufacturing Initiative (NEMI) has addressed the problem of tin whiskers in lead-free assemblies. A tin whisker is defined by them as... [Pg.698]

The National Electronics Manufacturing Initiative s (NEMTs) Tin Whisker Accelerated Test Project Press Release, September 26,2003—NEMI Team Recommends Three Test Conditions for Evaluating Tin Whisker Growth. [Pg.872]

NEMI, The National Electronics Manufacturing Initiative (NEMI) is an industry-led consortium whose mission is to assure leadership of the global electronics manufacturing supply chain. Its membership includes more than 60 electronics manufacturers, suppliers, associations, government agencies, and... [Pg.873]

The 2002 National Electronics Manufacturing Initiative (NEMI) roadmap cited design infrastructure — education, tools, and standard practices — as a major gap that hinders broad adoption of LTCC in volume applications. Mthout this necessary design infrastructure, the design cycle relies on multiple design-build-test iterations, a highly inefficient process. [Pg.84]

National Electronic Manufacturing Initiative, Inc. (NEMI) Year 2000 Roadmap, NEMI, Herndon, VA,2000. [Pg.80]

Among the various lead-free solder alloys, the National Electronics Manufacturing Initiative (NEMI) recommends Sn-3.9Ag-0.6Cu ( 0.2%) for reflow soldering (Ref 1), while JEITA (Japan Electronics and Information Technology Industries Association) recommends Sn-3.0Ag-0.5Cu. Under most typical use conditions, Sn-Ag-Cu (SAC) alloy in general exhibits a greater resistance to creep as compared to Pb-Sn alloy and hence creeps 10 to 100 times slower (Ref 2). The microstructure, the plastic and creep behavior, and the failure mechanism in Sn-Ag-Cu solder are vastly different compared to Pb-Sn solder, and therefore, it is important to develop appropriate thermomechanical predictive models for Sn-Ag-Cu solder. [Pg.181]

CAF conductive anodic filament NEMI National Electronics Manufacturing Initiative... [Pg.282]

NEMI lead free interconnect project statement of work. National Electronics Manufacturers Initiative, Herndon, VA, May 9, 2000, www.nemi.org/PbFreePUBLIC/index.html/. [Pg.47]

Two major microelectronics associations. National Electronics Manufacturing Initiative (NEMI) http //www.nemi.org/) and HDPUG (High Density Packaging Users Group http // www.hdpug.org/), are conducting lead-free solder projects to aid their industrial members in the conversion to lead-free assembly. [Pg.725]

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