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High Density Packaging Users Group

The High-Density Packaging User Group (HD-PUG) is a nonprofit organization of users and suppliers in the telecommunications and computer industries. HD-PUG includes members from North America, Europe, and Japan. The group, which endorsed NEMI s recommended alloy, is involved in lead-free issues among other environmental concerns such as halogen-free electronic materials. [Pg.163]

Two major microelectronics associations. National Electronics Manufacturing Initiative (NEMI) http //www.nemi.org/) and HDPUG (High Density Packaging Users Group http // www.hdpug.org/), are conducting lead-free solder projects to aid their industrial members in the conversion to lead-free assembly. [Pg.725]

HDP User Group International, Inc. (High Density Packaging)... [Pg.302]

See other pages where High Density Packaging Users Group is mentioned: [Pg.695]    [Pg.695]    [Pg.872]    [Pg.665]    [Pg.695]    [Pg.695]    [Pg.872]    [Pg.665]   
See also in sourсe #XX -- [ Pg.163 , Pg.665 , Pg.726 ]



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