Multilayer board processing Process control

Ordered polymer films made from poly benzthiazole (PBZT) and poly benzoxazole (PBO) can be used as substrates for multilayer printed circuit boards and advanced interconnects to fill the current need for high speed, high density packaging. Foster-Miller, Inc. has made thin substrates (0.002 in.) using biaxially oriented liquid crystal polymer films processed from nematic solutions. PBZT films were processed and laminated to make a substrate with dielectric constant of 2.8 at 1 MHz, and a controllable CTE of 3 to 7 ppm/°C. The films were evaluated for use in multilayer boards (MLBs) which require thin interconnect substrates with uniform controllable coefficient of thermal expansion (CTE), excellent dielectric properties, low moisture absorption, high temperature capability, and simple reliable processing methods. We found that ordered polymer films surpass the limitations of fiber reinforced resins and meet the requirements of future chip-to-chip interconnection. 

TLCPs have many outstanding properties that uniquely qualify them for these high performance multilayer boards (12). Table 7 compares the applicability of LCPs with other state-of-the-art materials for electronic packaging. They can be made into very thin, self-supporting films (<50 J.m) with a controllable CTE. By processing LCP films as described above, circuit substrates can be manufactured with a CTE around 7 ppm/°C and thermal stability over 250°C. TLCPs do not require secondary resins for fabrication into MLBs, they can be thermally bonded to themselves and to copper foil. Control of molecular orientation has been shown to result in a substrate with the desired CTE of 6 to 7 ppm/°C for matching alumina, or 16 ppm/°C for matching copper. 

Ceramic boards are currently widely used in high-performance electronic modules as interconnection substrates. They are processed from conventional ceramic precursors and refractory metal precursors and are subsequently fired to the final shape. This is largely an art a much better fundamental understanding of the materials and chemical processes will be required if low-cost, high-yield production is to be realized (see Chapter 5). A good example of ceramic interconnection boards are the multilayer ceramic (MLC) stractures used in large IBM computers (Figure 4.11). These boards measure up to 100 cm in area and contain up to 33 layers. They can interconnect as many as 133 chips. Their fabrication involves hundreds of complex chemical processes that must be precisely controlled. 

Adjustable Workbench (PAW) instrument assembly. The SH shown in Figs. 3.15 and 3.16 contains the electromechanical transducer (mounted in the center), the main and reference Co/Rh sources, multilayered radiation shields, detectors and their preamplifiers and main (linear) amplifiers, and a contact plate and sensor. The contact plate and contact sensor are used in conjunction with the IDD to apply a small preload when it places the SH holding it firmly against the target. The electronics board contains power supplies/conditioners, the dedicated CPU, different kinds of memory, firmware, and associated circuitry for instrument control and data processing. The SH of the miniaturized Mossbauer spectrometer MIMOS II has the dimensions (5 x 5.5 x 9.5) cm and weighs only ca. 400 g. Both 14.4 keV y-rays and 6.4 keV Fe X-rays are detected simultaneously by four Si-PIN diodes. The mass of the electronics board is about 90 g [36],... 

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