Multichip packaging technologies

Thick-Film Multilayer. Thick-film multilayer technology has been used for many years to fabricate hybrid circuits that interconnect small-scale ICs or discrete components on a ceramic or metal substrate (67-70). This technology has also been used for multichip packaging of more highly integrated ICs for large computer applications. 

Guidelines for Multichip Module Technology Utilization, IPC-MC-790. Lincolnwood, IL Institute of Interconnecting and Packaging Electronic Circuits Aug. 1992. 

Dehkordi, P., Ramamurthi, K., Bouldin, D., Davidson, H., and Sandborn, P. 1995. Impact of packaging technology on system partitioning A case study. In 1995 IEEE MCM Conference, pp. 144—151. Doane, D.A. and Franzon, P.D., eds. 1992. Multichip Module Technologies and Alternatives The Basics. Van Nostrand Reinhold, New York. 

Pricing as well as reliability considerations have led to an almost exclusive use of Si-based (i.e. Si and SOI) micro machined devices. Packaging and assembly has focused on ceramics (A1203, AIN, Low Temperature Co-fired Ceramics LTCC), Printed Circuit Board (PCB-) and Surface Mount Device (SMD-) technology and multichip modules (MCM s). 

Otsuka, K., Multilayer Geramic Substrate Technology for VLSI Package/Multichip Module, London Elsevier, 1993. 

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