Microstructure metal

Volume 12 Metal Microstructures in Zeolites. Preparation - Properties -Applications. Proceedings of a Workshop, Bremen, September 22-24,1982 edited by P.A. Jacobs, N.l. Jaeger, P. Jitu and G. Schulz-Ekloff... 

A form of corrosion occurring at the grain boundaries within a metals microstructure. 

Volume 12 Metal Microstructures in Zeolites. Preparation - Properties - Applications. 

Rogers, J. A. Jackman, R. J. Whitesides, G. M. 1997. Microcontact printing and electroplating on curved substrates Production of free-standing three-dimensional metallic microstructures. Adv. Mater. 9 475 477. 

Table 11. Quantitative metallography comparison of the alloy parent metal microstructures.

Lunsford, J. H. In Metal Microstructures in Zeolites Jacobs, P. A. Jaeger, P. Jiru, P. Schulz-Ekloff, G., Eds. Studies in Surface Science and Catalysis 12 Elsevier Scientific Publishing Company Amsterdam, The Netherlands, 1982, 1-13. 

R.J. Jackman, S.T. Brittain, A. Adams, H. Wu, M.G. Prentiss, S. Whitesides, G.M. Whitesides, Three-dimensional metallic microstructures fabricated by soft lithography and microelectrodeposition. Langmuir 15, 826-836, 1999. 

EMM can be applied to either Al films, typically deposited on SiCVSi substrates, or Al foils. The dimensions of metallic features are determined by the same rules the etch factor, the depth of porous-type anodization, the mask design, and process conditions. In addition to the fabrication of metallic microstructures, EMM can be used to produce microstructured ceramic substrates composed of porous AI2O3. For the fabrication of both types of 3D microstructures by localized porous-type anodization, the following technological problems have to be addressed the reliability of a mask material, the fidelity of the mask transfer, volumetric expansion of porous AI2O3 during anodization, and the effect of the mask design on the rate of porous-type anodization and on the completion of anodization of the entire thickness of Al without traces of Al islands. 

The plastic structures can again be filled with metal in a second electroforming (electrodeposition) process. Thus, metallic microstructures can be fabricated in an economic, low cost and effective way. The plastic inicrostructures can also serve as so called lost molds for the production of ceramic microstructures. In this case, the mold is filled, for example by means of a slip casting process. During firing of the ceramic, the polymer is completely degraded and evaporates. 

The standard LIGA process is then followed polymerization of the thick X-ray resist directly on to the substrate, exposure to synchrotron radiation through a precisely adjusted mask, development of the resist, and electrodeposition. Some parts of the metallic microstructures are built up on the first metal layer, while other parts lie on top of the sacrificial layer. After stripping the resist, the sacrificial layer is etched selectively against all the other materials. 

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