Assembling and Bonding of Metal Microstructures

Another problem of the microscale is the surface quality of the single parts of a device. Burr formation generated by mechanical micromachining or laser machining 

For high-pressure applications and very secure run of chemical reactions, diffusion-bonded metal devices are the optimum choice. As a result of the process 

It is obvious that the choice of the bonding technique has to be made depending on the process parameters. It is not possible to run a device bonded by low-temperature soldering at some 100 °C. Thus, the most relevant parameters for the choice of 

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