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Level at ambient temperature

Thus, for a micro mass, the open-loop damping should be kept as low as possible for an acceptable noise level at ambient temperature. High-purity silicon spring elements are almost perfectly elastic, and the spring is operating in vacuum to avoid air damping, so the mechanical damping can be held quite low. [Pg.2513]

Chenisorptlon results are given after a "standard" reduction procedure as well as after a "super" reduction involving extremely efficient removal of the water generated. Water contents of moist treating gases were always the saturation level at ambient temperature (ca. 2.4 vol.Z) unless otherwise stated. [Pg.208]

Stabilizers. Hydroquinone [123-31 -9] (4) is widely used in commercial resins to provide stabiHty during the dissolution of the hot polyester resin in styrene during the manufacturing process. Aeration of the styrene with oxygen (air) is required to activate the stabilizer, which is converted to an equiHbrium mixture of quinone and the quinhydrone (5) (11). At levels of 150 ppm, a shelf life of over 6 months can be expected at ambient temperatures. [Pg.317]

Because of their ordered stmcture, molecular sieves have high capacity at low water concentrations and do not exhibit a capiHary condensation pore-filling mechanism at high water concentrations. The desiccating properties of the material are stiU good at elevated temperatures (Fig. 10). A dew point of —75° C can be obtained in a gas dried at 90°C with a molecular sieve that adsorbs water to the level of 1 wt %. In normal operations at ambient temperature, dew points of < — 100° C have been measured. [Pg.513]

It is especially important for the JP-4 type products since they produce a typical explosive atmosphere at ambient temperatures above the liquid level. [Pg.277]

This process is carried out at low pressure and at ambient temperature. The fiber is placed in the tool in the form of a mat and the resin is poured in. The mold is closed, and the resin spreads through the reinforcement thereby impregnating and fully wetting out the fiber strands. The process is done on an hydraulic press. Pressure levels required for molding are typically around 10 MPa. Gel coat can be applied to the mold faces before the molding operation commences. [Pg.818]

Basicity also may be regarded as a measure of amine hydrolysis, and it governs the increase in pH level, per additional unit measure of amine. The law of diminishing returns applies of course, and beyond a certain point there is little further increase in system pH. Also, the basicity constant for individual amines varies considerably with temperature, so it is important to consider Kb at the relevant operating temperature, rather than simply at ambient temperature. [Pg.525]

An aqueous solution of sodium sulfite, which was prepared at ambient temperature (or bisulfite, but free of thiosulfite) at a concentration of about 20%, is added to the reaction vessel. Usually 1.05-1.1 mol of the sulfite is required. The temperature is kept at 70-90°C with continuous stirring. The reaction can be finished when analytical data, e.g., content of free sulfite, are sufficient to fit the specification. Time required for the second step is around 30 min to 1 h. Finally the pH is adjusted to the desired level. [Pg.510]

On release, vapours which are less dense than air at ambient temperature may tend to spread at low level when cold (e.g. vapour from liquid ammonia or liquefied natural gas spillages). [Pg.18]

Zinc oxide is a thoroughly studied typical semiconductor of n-type with the width of forbidden band of 3.2 eV, dielectric constant being 10. Centers responsible for the dope electric conductivity in ZnO are provided by interstitial Zn atoms as well as by oxygen vacancies whose total concentration vary within limits 10 - 10 cm. Electron mobility in monocrystals of ZnO at ambient temperature amounts to 200 cm -s". The depth of donor levels corresponding to interstitial Zn and oxygen vacancies under the bottom of conductivity band is several hundredth of electron volt [18]. [Pg.114]

With respect to periodic reversal of flow direction, this seems to be competitive for low levels of smelter gas S02, probably under 4 vol%, at ambient temperature. If S02 is too high, thermal runaway can occur. A second, important application is to reduce S02 in the off-gas from a conventional acid plant. Use of flow reversal avoids the problem of reheating the gas leaving the first-stage absorber. [Pg.272]


See other pages where Level at ambient temperature is mentioned: [Pg.1989]    [Pg.458]    [Pg.31]    [Pg.207]    [Pg.1989]    [Pg.458]    [Pg.31]    [Pg.207]    [Pg.242]    [Pg.1877]    [Pg.442]    [Pg.455]    [Pg.197]    [Pg.204]    [Pg.281]    [Pg.285]    [Pg.346]    [Pg.66]    [Pg.199]    [Pg.272]    [Pg.954]    [Pg.48]    [Pg.1065]    [Pg.1122]    [Pg.134]    [Pg.359]    [Pg.379]    [Pg.300]    [Pg.443]    [Pg.255]    [Pg.139]    [Pg.525]    [Pg.342]    [Pg.170]    [Pg.29]    [Pg.48]    [Pg.166]    [Pg.81]    [Pg.426]    [Pg.728]    [Pg.95]    [Pg.96]    [Pg.46]    [Pg.370]   
See also in sourсe #XX -- [ Pg.91 , Pg.92 , Pg.97 , Pg.98 ]




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Ambient

Ambient temperatures

Temperature level

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