International studies, lead-free solder

D. Shangguan, Study of Compatibility for Lead-free Solder PCB Assembly, Proceedings of the IPC and Soldertec First International Conference on Lead-Free Electronics, June 2003, p 298-308... 

P. Vianco, I. Artaki, and A. Jackson, Reliability Studies of Surface Mount Boards Manufactured with Lead-Free Solders, Surface Mount International Proc., 1994, p 437 8... 

The International Tin Research Institute, ITRI Ltd., based in Uxbridge, England, has been involved in solder research since 1932 and has conducted lead-free solder studies since the late 1980s. ITRI opened Soldertec, a lead-free soldering technology center supported by more than 50 industrial members in 1999. The center studies a variety of aspects related to the development of lead-free technology, including production and reliability concerns. 

The National Center for Manufacturing Sciences (NCMS) backed by a consortium of North American industrial corporations, national laboratories, and academic institutions conducted an evaluation of alternatives to eutectic Sn-Pb solder between 1992 and 1996. Corporate participants included ATT-Lucent, Ford Motor Company, GM-Delco Electronics, GM-Hughes Aircraft, Hamilton Standard, National Institute for Standards and Technology (NIST), Rensse-lear Polytechnic Institute, Rockwell International, Sandia National Laboratories, Texas Instruments, and the U.S. Navy s Electronics Manufacturing Productivity Facility. The goal of the project was to determine whether safe, cost-effective, nontoxic, reliable lead solder alternatives could be identified. With over 79 alloys examined, the study results indicated that while a number of possible lead-free solders were functionally possible, there was no universal drop-in replacement for lead-based solders in electronics applications. This study is discussed in detail in Chap. 17. 

Major International Lead (Pb)-Free Solder Studies... 

MAJOR INTERNATIONAL LEAD (PB)-FREE SOLDER STUDIES... 

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