Interdiffusion metallic

Interstitial diffusion is rarely possible when two metals interdiffuse, since their atomic radii are usually of the same order. Several mechanisms have been proposed, but it is now generally accepted that interdiffusion is due to the motion of vacant sites within the lattice, solvent and solute atoms moving as the vacant sites migrate. The diffusion process is thus dependent upon the state of imperfection of the solvent metal and the alloy being formed. 

Many workers have tried to omit the mercury film by depositing the analyte directly on inert metals such as Pt, Au, Rh, Ir or Ag or on carbon materials such as glassy carbon or wax-impregnated graphite however, in general this was not successful (lack of selectivity for mixtures as a consequence of interdiffusion) and therefore it is rarely applied except for those nobler analyte metals that cannot be measured at mercury, such as Au, Ag and Hg itself. Nevertheless, metals such as Ni and Cr, which do not amalgamate, can be determined on an HMDE100. 

Hence, the decision to use a heated substrate with simultaneous evaporation of the component metals as an aid to homogenization requires consideration of whether or not it might have an adverse effect, i.e., causing preferential nucleation of one component, which interdiffusion may not be able to remedy. It was believed (60) that in preparing Pd-Rh alloys by simultaneous deposition on a substrate at 400°C, rhodium nucleated preferentially and that crystallites grew by the addition of palladium (and rhodium) atoms. The diffusion of palladium atoms into this kernel formed a phase with 88 =t 5% Rh (phase II). The outer shell of the crystallite, phase I, was in effect a solid solution deficient in rhodium compared with the overall film composition, and the Rh content of phase I therefore increased as the Rh flux was increased. 

The interdiffusion of gold and platinum is much slower than that of copper and nickel, and films formed by successive evaporation of the component metals were not brought to equilibrium by sintering at 200°C. Films formed by simultaneous evaporation were equilibrated by sintering... 

The above sections have focused upon homogeneous systems with a constant composition in which tracer diffusion coefficients give a close approximation to selfdiffusion coefficients. However, a diffusion coefficient can be defined for any transport of material across a solid, whether or not such limitations hold. For example, the diffusion processes taking place when a metal A is in contact with a metal B is usually characterized by the interdiffusion coefficient, which provides a measure of the total mixing that has taken place. The mixing that occurs when two chemical compounds, say oxide AO is in contact with oxide BO, is characterized by the chemical diffusion coefficient (see the Further Reading section for more information). 

Thermally Activated Processes - Any detrimental thermally activated processes can be affected beneficially such as chromium vaporization, elemental interdiffusion and migration, metallic corrosion affects and some ceramic aging affects. 

A comparison was made between Ni and Co diffusion barriers produced by electroless, electro-, and evaporation deposition (64). This comparison shows that only electrolessly deposited metals and alloys, at a thickness of 1000 im, have barrier properties for Cu diffusion. For Co(P) 1000-pm-thick barriers, annealed for 14h, the amount of Cu interdiffused into Co(P) is less than 1 at %. Thicker barriers of Ni(P), Ni(B), and Co(B) are required for the same degree of Cu interdiffusion. The same metals, if electrodeposited, both do and do not have inferior barrier properties. This... 

In some instances, to improve solderability, tin is deposited on nickel surfaces. In a short time, however, interdiffusion of the two metals results in the growth of an inter-metallic NiSn3 compound that is much less amenable to soldering. For tin over elec-trolessly deposited nickel surfaces, the interdiffusion results in pores in both films. Pores are to be avoided, of course, if conductivity and/or contact resistance is an issue. 

Diffusion must not, however, always be viewed as being a harmful phenomenon. In some cases it is most desirable, if not essential. Such is the case in welding (5), where diffusion ensures joining of the welded parts. Steel is often coated with tin to protect it from corrosion. In this case the formation, via interdiffusion, of the inter-metallic FeSu2 is the key for effective protection. 

Sometimes interdiffusion between two metals is uneven and may lead to the creation of vacancies or voids. This type of imbalance is the result of possible unequal mobilities between a metal couple. These voids occur individually near the common interface. The voids, like bubbles, coalesce, resulting in porosity and loss of strength. Many thin-fihn couples exhibit this phenomenon, which is referred to as Kirkendall void creation. Al-Au, Cu-Pt, and Cu-Au are just a few examples. To be specific, it has been found (7), for instance, that in the case of Au-Ni, about five times more Ni atoms diffuse into Au than Au atoms diffuse into Ni. 

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