Integrated circuits, patterning with

To understand the impact of a CMP process on a certain product with a unique integrated circuit pattern, it is desirable to measure areas with different feature sizes and shapes. Since CMP polish rate may be affected by pattern density, areas encompassing various features should be included in the measurement program. The within-die thickness nonuniformity will indicate the planarization capability of a CMP process. 

Microelectronic device fabrication currently relies primarily upon photoresist processing for integrated circuit pattern delineation. Adhesion of polymeric photoresist patterns, especially those of micron and submicron dimensions, to the required fabrication substrates is of paramount importance. Photoresist image adhesion problems encountered in device fabrication have been solved by chemical interfacial treatments. Current new trends in microelectronic adhesion technology will be described and discussed with emphasis upon the chemical nature of the interface involved as determined by ESCA. 

The chemical modification of surfaces and films i essential in the manufacture of integrated circuits. Patterns and material must be transferred to substrate surfaces and removed from them. As the dimensions of advanced electronic devices shrink to the submicron and molecular scale, properties of the processing techniques become increasingly critical. Characteristics such as low temperatures, low levels of induced dam. ge and contamination, and molecular scale selectivity and controllabilit] are essential. The use of radiation-induced chemistry is desirable if it can be conducted at lower temperatures and with smaller levels of damage and contamination than particle impact and thermal methods. 

Deposition of Thin Films. Laser photochemical deposition has been extensively studied, especially with respect to fabrication of microelectronic stmctures (see Integrated circuits). This procedure could be used in integrated circuit fabrication for the direct generation of patterns. Laser-aided chemical vapor deposition, which can be used to deposit layers of semiconductors, metals, and insulators, could define the circuit features. The deposits can have dimensions in the micrometer regime and they can be produced in specific patterns. Laser chemical vapor deposition can use either of two approaches. 

To fabricate the integrated circuit (IC), layers with various electrical properties must be introduced into or deposited onto the substrate. These layers may consist of insulating, semiconducting, and conducting films. The construction of the layers in only the desired areas relies on a series of patterning steps which is briefly illustrated in Figure 1. Light sensitive... 

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