High speed circuits

The reproducible assembly of high-performance NW-TFTs in high yield readily enables construction of more complicated high-speed circuits on... 

There are many elements and alloys that possess the electrical property known as band gap [5] that are useful for semiconductor devices. Silicon became the lynchpin material for device fabrication. It is currently, and will continue to be, the most important material for integrated circuit fabrication. Alloys of group III and V elements are important for optical devices such as lasers, optical detectors, and specialized high-speed circuits. In this paper, the fabrication of silicon devices will be used to illustrate the role of chemical processing in circuit manufacture. 

Circuit Switched Data (CSD) transmission, which is the switched transmission of digital data with speeds up to 9.6 kbps via traffic channel an option of the CSD mode is a High Speed Circuit Switched Data (HSCSD) with speeds up to 57.6 kbps ... 

Low dielectric constant (less than 2.8) for low power loss and high speed circuits... 

Henn Ch (1993) New ultra high-speed circuit techniques with analog ICs (AB-183). Burr-Brown, Tucson... 

Clocks and Clock Schemes in High-Speed Circuit Design... 

Mikazuki,T. andMatsui,N. 1994. Statistical design techniques for high speed circuit boards with correlated structure distributions. IEEE Trans. Comp. Pac., Man. Tech. 17(1) 159-165. 

A variety of low-dielectric, low-loss resin systems are available for high-speed circuit apph-cations. These include polytetrafluoroethylene (FTFE or Teflon ), cyanate ester, epoxy blends, and allylated polyphenylene ether (APPE). Likewise, a few different reinforcements and fillers are available that can be used to modify the electrical properties of the base material. Although E-glass is stm the most commonly used fiberglass reinforcement, it should be noted that others are available. In addition, inorganic fillers are sometimes used to modify electrical properties as well. Table 9.6 provides electrical property data on some of the available fiberglass materials. Table 9.7 provides data on some of the base material composites available. 

Dielectric constant For RF and high-speed circuits, a material with a low dielectric constant will change circuit performance less than a material with a higher one. 

A silver paste thick-film flexible circuit built on polyester film can provide the lowest-cost solution for large circuits. Unfortunately, the conductivity of the traces is much lower than for copper foil conductors, and this material is not available for power circuits or signal layers of high-speed circuits. Standard soldering is not available because of the acryUc-based matrix. 

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