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Further Tape Processing

Once the tape-cast product has been fabricated in either sheet or roll form, it is ready for evaluation and characterization before being processed into a useful shape or part. This chapter will cover the green tape characterization techniques and procedures that are used in industry as well as procedures we have instituted in our laboratory. The remainder of the chapter will address the downstream processing steps followed in the final shaping procedures to produce parts for specific products. These procedures include blanking, punching, calendering, and lamination. First we will review the tape characterization procedures and techniques. [Pg.187]


The remainder of this book will describe in detail the materials selection process, materials processing and characterization prior to tape casting, the tape casting process and equipment, further tape... [Pg.3]

There are several mechanisms by which wow can occur. One cause is a variation of rotational speed of the recording medium during either recording or playback. A further cause is eccentricity in the recording or playback process for disc and cylinder recordings, for example a hole which is not punched perfectly at the centre of a gramophone disc. Lastly it is possible for magnetic tape and optical film to become... [Pg.389]

The process has the advantage that the green tape is free from porosity since there is no solvent loss and the ceramic powder is very well dispersed with the elastomer uniformly distributed. The tape can be further processed for substrates or multilayer capacitors in the same way as band-cast material. [Pg.111]

For planar sensors manufactured by multilayer technology, the recently developed ceramic tape casting process was improved further [17, 18]. ZrOz powder is mixed into an organic matrix of binders, plasticizers, and solvents and is tape cast onto a Mylar supporting tape or a steel belt After drying, the ceramic tape is separated from the support tape and the flexible green tape can be punched to form individual substrates. [Pg.168]


See other pages where Further Tape Processing is mentioned: [Pg.187]    [Pg.189]    [Pg.191]    [Pg.193]    [Pg.195]    [Pg.197]    [Pg.199]    [Pg.201]    [Pg.203]    [Pg.205]    [Pg.207]    [Pg.288]    [Pg.187]    [Pg.189]    [Pg.191]    [Pg.193]    [Pg.195]    [Pg.197]    [Pg.199]    [Pg.201]    [Pg.203]    [Pg.205]    [Pg.207]    [Pg.288]    [Pg.30]    [Pg.38]    [Pg.1295]    [Pg.426]    [Pg.185]    [Pg.467]    [Pg.155]    [Pg.866]    [Pg.255]    [Pg.328]    [Pg.381]    [Pg.130]    [Pg.599]    [Pg.661]    [Pg.1289]    [Pg.185]    [Pg.9]    [Pg.404]    [Pg.32]    [Pg.109]    [Pg.563]    [Pg.372]    [Pg.281]    [Pg.269]    [Pg.79]    [Pg.456]    [Pg.106]    [Pg.3]    [Pg.93]    [Pg.203]    [Pg.85]    [Pg.452]    [Pg.52]    [Pg.8]   


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