Flexible circuits Circuit elements

The panel was produced as follows (Fig. 10.5). A donor film with the structure previously described and coated with a 1-pm DNNSA-PANI/SWNT composite [15] was used to print all conducting circuit elements. First, the large donor film was held by vacuum on the flexible receiver. The gate layer was then printed by selectively exposing the DNNSA-PANI/SWNT donor film as previously described. When exposure was complete the receiver was removed and a l-pm dielectric layer was applied over the whole area. The receiver is then repositioned on to the drum in registry for laser printing of the source/drains and interconnects. The widths of... 

The MOSFET is an extremely flexible circuit element because there can be n- and p-channel devices with current that increases or decreases with gate voltage. The capacitance of MOSFET structures can also be used for charge storage. The stored charge can be shifted from one capacitor to an adjacent element by control of the gate voltages. 

Electrical and electronic parts, various types of connectors (board-to-board connectors, flexible printed circuit connectors, card connectors, flash memory connectors, optical connectors), various types of sockets (PGA sockets, ZIF sockets, SIMM sockets, RIMM sockets, SO-DIMM sockets), relay casings, switches, quartz oscillators, piezoelectric elements, capacitors, sensors, coil bobbins, optical sensors, and encapsulant... 

Process elements particular to flexible circuits are required to achieve a high manufacturing yield. Also, an appropriate total process design is required to achieve high productivity with high yield. 

FALLO Follow ALL Opportunities FBF Film and Bag Federation of SPI FC fuzzy control FDA finite difference analysis FDA Food Drug Administration FEA finite element analysis FEP fluorinated ethylene-propylene FFS form, fill, seal FLC fuzzy logic control FMCT fusible metal core technology FPC flexible printed circuit fpm feet per minute FR flame retardant FRCA Fire Retardant Chemicals Assoc. 

When molded or premolded packages cannot be used for whatever reason, for example, a need for hermetic sealing, modules using ceramic substrates (or PCB-printed circuit board) offer almost unlimited flexibility. They can be used for simple multichip modules containing two or more elements (e.g., a sensing element and an evaluation circuit), may include external components, or may be used to construct complete systems. Stress-optimized package configurations for sensitive microsystems and sensors are no problem (Fig. 5.8.4). 

The single-storage heater is heated by an electric element embedded in bricks and rated between 6 and 15kW depending upon its thermal capacity. A radiator of this capacity must be supplied on its own circuit, in cable capable of carrying the maximum current demand and protected by a fuse or miniature circuit-breaker (MCB) of 30, 45 or 60 A as appropriate. At the heater position, a DP switch must be installed to terminate the fixed heater wiring. The flexible cables used for the final connection to the heaters must be of the heat-resistant type. 

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