Eyman

Eyman WJ, Reehl WF, Rosenblatt DH. 1982. Handbook of Chemical Property Estimation Methods. Environmental behavior of organic compounds. New York, NY McGraw-Hill Book Co, 15-9 to 15-31. 

Runnels and Eyman [41] report a tribological analysis of CMP in which a fluid-flow-induced stress distribution across the entire wafer surface is examined. Fundamentally, the model seeks to determine if hydroplaning of the wafer occurs by consideration of the fluid film between wafer and pad, in this case on a wafer scale. The thickness of the (slurry) fluid film is a key parameter, and depends on wafer curvature, slurry viscosity, and rotation speed. The traditional Preston equation R = KPV, where R is removal rate, P is pressure, and V is relative velocity, is modified to R = k ar, where a and T are the magnitudes of normal and shear stress, respectively. Fluid mechanic calculations are undertaken to determine contributions to these stresses based on how the slurry flows macroscopically, and how pressure is distributed across the entire wafer. Navier-Stokes equations for incompressible Newtonian flow (constant viscosity) are solved on a three-dimensional mesh ... 

Eyman, L. D., and Trabalka, J. R., Transuranics in Natural Environment, (NVO-178), pp. 477-488, Nevada Applied Ecology Group, Las Vegas, Nevada (1977). 

Healy, J. W., Eyman, L. 0., and Trabalka, J. R., Transuranic Uptake by Aquatic Organisms, (Appendix I) in an Examination of Possible Limits for the Shallow Earth Burial of Transuranic Wastes, Los Alamos Scientific Laboratory, Los Alamos,... 

Willey, J. D., R. J. Kieber, M. S. Eyman, and G. Brooks Avery, Jr. 2000. Rainwater dissolved organic carbon Concentrations and global flux. Global Biogeochemical Cycles 14 139-148. 

Runnel S, Eyman L. Tribology analysis of chemical-mechanical polishing. J Electrochem Soc 1994 141 1698. 

The existence of a fluid layer is beneficial for two reasons. First the fluid layer will act as a lubricating agent and conduct heat away from the surface. Second, slurry transport is expected to be more efficient with a fluid layer. It is expected that CMP does indeed involve a fluid layer that is either continuous or partial. It is not clear, however, if the fluid layer is partial or continuous. In the remainder of this section, we discuss the results of a tribological analysis by Runnels and Eyman, while in Section 4.4.2 we shall discuss the implications of partial or continuous fluid layers on the mode of abrasion. 

Runnels and Eyman consider the wafer, with some finite curvature, to be held by a carrier which is mounted via a gimbal mechanism as shown in Figure 4.2. The wafer then glides at an angle of attack, 6, upon a slurry fluid layer of thickness h. Runnels... 

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