Stamp epoxy

MAJOR USES Used in the production of epoxy resins, polyurethane, shoe soles, rolls for postage stamp machines, plywood, computers and pulleys for escalators and elevators. 

Table I shows what adhesives A, B, and C correspond to Budd type troughs used in this program. One additional type of trough was used in which the stamped sheet metal back is replaced by an aluminum honeycomb structure. This is known as the PAR series. Epoxy Y was used in that structure.

Epo-Tek H70E/ Epoxy Technology High-speed epoxy chip bonding 4,000-7,000/50 N/A NA Screen print, machine dispense, or stamp transfer... 

MRSI-175Ag/ Newport Corp. 12 X 10 — Positive displacement, stamp dispensing (5-mil dots achievable)/ 8,000 Conductive epoxy dispensing, including SMT SMT adhesives Chipbonder 3615, Dymax 9-20367, and 9-20368, Amicon D124 F 15, D125 F, and 125F DR. 

In machine construction and instrument and tool manufacture, plain bearings, axle bearing guides, bushings, etc., are made by bonding, and punches are cemented into stamping tools with epoxy resins, cyanoacrylates, and acrylate adhesives. Screws, gear wheels, shafts, etc., are secured with anaerobic adhesives. 

Adhesives are polymers in this general class of materials used in many applications, from the back of postage stamps to demanding military applications cementing metal joints in military aircraft with polymers such as epoxy resins. The interfaces of such materials must be characterized to determine the strength of the adhesive bonds and the relation of properties such as peel strength with morphology. Adhesion science has been described in the literature (e.g., [517, 519-523]. 

Other, nonelastomeric, hard polymers that have been rrsed for stamps include PMMA, poly([3-mercaptopropyl] methylsiloxane) (PMMS), PS," and epoxy resin. " The use of photocurable elastomers enables low-temperature curing, and eliminates heating steps and concomitant distortion of the master and stamp."" " ... 

FIGURE 14.29 Making a stamping die from a filled epoxy resin (a) pattern placed in box (b) resin added and hardened to make lower half of die (c) pattern removed and lower half of die inverted and coated with release agent (d) resin added and hardened to make upper half of die (e) two halves of die mounted in press to form metal sheet, M. 

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