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Epoxy resin thermoset

Cross-linked epoxy resin (thermoset of bisphenol A diglycidyl ether). [Pg.395]

A closely related method to the in situ polymerisation processing of composites is based on epoxy resins thermosets. In this approach, CNTs can be dispersed in a liquid epoxy precursor and then the mixtures can be cured by the addition of hardener, such as triethylene tetramine (TETA), and the application of temperature or pressure. In most cases, the epoxy monomer exists in liquid state, facilitating nanotube dispersion. Curing is then carried out to... [Pg.89]

Fig. 13.41 The temperature dependence of the critical fracture energy Gic in DGEBA epoxy-resin thermosets, modified either by rubber particles or by debonding glass spheres, either in tests of conventional extension rates or in Izod impact tests, compared with the generally flat behavior of unmodified epoxy resin (Kinloch (1985) courtesy of Springer). Fig. 13.41 The temperature dependence of the critical fracture energy Gic in DGEBA epoxy-resin thermosets, modified either by rubber particles or by debonding glass spheres, either in tests of conventional extension rates or in Izod impact tests, compared with the generally flat behavior of unmodified epoxy resin (Kinloch (1985) courtesy of Springer).
Epoxy resins. Thermosetting materials which may be syrupy liquids or solids. Possessing excellent heat and chemical resistance, they are used as adhesives and for paints. [Pg.16]

BMI/Epoxy resins [COMPOSITE MATERIALS - POLYTffiR-MATRM - THERMOSETS] (Vol 7) Electrically charged membrane... [Pg.354]

The binder system of a plastic encapsulant consists of an epoxy resin, a hardener or curing agent, and an accelerating catalyst system. The conversion of epoxies from the Hquid (thermoplastic) state to tough, hard, thermoset soHds is accompHshed by the addition of chemically active compounds known as curing agents. Flame retardants (qv), usually in the form of halogens, are added to the epoxy resin backbone because epoxy resins are inherently flammable. [Pg.530]

Thermosetting-encapsulation compounds, based on epoxy resins (qv) or, in some niche appHcations, organosiHcon polymers, are widely used to encase electronic devices. Polyurethanes, polyimides, and polyesters are used to encase modules and hybrids intended for use under low temperature, low humidity conditions. Modified polyimides have the advantages of thermal and moisture stabiHty, low coefficients of thermal expansion, and high material purity. Thermoplastics are rarely used for PEMs, because they are low in purity, requHe unacceptably high temperature and pressure processing conditions. [Pg.530]

A variety of thermosetting resins are used in SMC. Polyesters represent the most volume and are available in systems that provide low shrinkage and low surface profile by means of special additives. Class A automotive surface requirements have resulted in the development of sophisticated systems that commercially produce auto body panels that can be taken direcdy from the mold and processed through standard automotive painting systems, without additional surface finishing. Vinyl ester and epoxy resins (qv) are also used in SMC for more stmcturaHy demanding appHcations. [Pg.96]

Epoxy Resins. Epoxy resins (qv) or polyether resins are thermosets used as the binder for terrazzo dooring. The epoxy resin often is made from epichlorohydrin and bisphenol A. An excess of epichlorohydrin is used to assure that the intermediate product contains terminal epoxide groups. [Pg.327]

The thermoplastic or thermoset nature of the resin in the colorant—resin matrix is also important. For thermoplastics, the polymerisation reaction is completed, the materials are processed at or close to their melting points, and scrap may be reground and remolded, eg, polyethylene, propjiene, poly(vinyl chloride), acetal resins (qv), acryhcs, ABS, nylons, ceUulosics, and polystyrene (see Olefin polymers Vinyl polymers Acrylic ester polymers Polyamides Cellulose ESTERS Styrene polymers). In the case of thermoset resins, the chemical reaction is only partially complete when the colorants are added and is concluded when the resin is molded. The result is a nonmeltable cross-linked resin that caimot be reworked, eg, epoxy resins (qv), urea—formaldehyde, melamine—formaldehyde, phenoHcs, and thermoset polyesters (qv) (see Amino resins and plastics Phenolic resins). [Pg.456]

Practical methods for synthesis and elucidation of the optimum physical forms were developed at Du Pont (13). The violets fill the void in the color gamut when the inorganics are inadequate. The quinacridones may be used in most resins except polymers such as nylon-6,6, polystyrene, and ABS. They are stable up to 275°C and show excellent weatherabiUty. One use is to shade phthalocyanines to match Indanthrone Blue. In carpeting, the quinacridones are recommended for polypropylene, acrylonitrile, polyester, and nylon-6 filaments. Predispersions in plastici2ers ate used in thermoset polyesters, urethanes, and epoxy resins (14). [Pg.462]

Currendy, epoxy resins (qv) constitute over 90% of the matrix resin material used in advanced composites. The total usage of advanced composites is expected to grow to around 45,500 t by the year 2000, with the total resin usage around 18,000 t in 2000. Epoxy resins are expected to stiH constitute about 80% of the total matrix-resin-systems market in 2000. The largest share of the remaining market will be divided between bismaleimides and polyimide systems (12 to 15%) and what are classified as other polymers, including thermoplastics and thermoset resins other than epoxies, bismaleimides, cyanate esters, and polyimide systems (see Composites,polymer-matrix-thermoplastics). [Pg.19]

Commonly accepted practice restricts the term to plastics that serve engineering purposes and can be processed and reprocessed by injection and extmsion methods. This excludes the so-called specialty plastics, eg, fluorocarbon polymers and infusible film products such as Kapton and Updex polyimide film, and thermosets including phenoHcs, epoxies, urea—formaldehydes, and sdicones, some of which have been termed engineering plastics by other authors (4) (see Elastol rs, synthetic-fluorocarbon elastol rs Eluorine compounds, organic-tdtrafluoroethylenecopolyt rs with ethylene Phenolic resins Epoxy resins Amino resins and plastics). [Pg.261]

The commercial possibiUties for epoxy resins were first recognized by DeTrey Emres in Switzerland and DeVoe and Raynolds in the United States (1,2). In 1936, DeTrey Emres produced a low melting bisphenol A-based epoxy resin that gave a thermoset composition with phthaUc anhydride. Apphcation of the hardened composition was foreseen in dental products, but initial attempts to market the resin were unsuccessful. The patents were hcensed to CIBA AG of Basel, Switzerland (now CIBA-GEIGY), and in 1946 the first epoxy adhesive was shown at the Swiss Industries Eair and samples of casting resin were offered to the electrical industry. [Pg.362]

In planning cathodic protection, the specific resistivity of the water, the size of the surfaces to be protected and the required protection current densities have to be determined. The protection current density depends on the type and quality of the coating. Thermosetting resins (e.g., tar-epoxy resin coatings) are particularly effective and are mostly used today on coastal structures. They are chemically... [Pg.376]


See other pages where Epoxy resin thermoset is mentioned: [Pg.553]    [Pg.193]    [Pg.262]    [Pg.1683]    [Pg.103]    [Pg.553]    [Pg.193]    [Pg.262]    [Pg.1683]    [Pg.103]    [Pg.160]    [Pg.19]    [Pg.55]    [Pg.115]    [Pg.261]    [Pg.293]    [Pg.366]    [Pg.467]    [Pg.532]    [Pg.291]    [Pg.303]    [Pg.144]    [Pg.144]    [Pg.521]    [Pg.452]    [Pg.319]    [Pg.321]    [Pg.7]    [Pg.19]    [Pg.19]    [Pg.372]    [Pg.493]    [Pg.362]    [Pg.371]    [Pg.979]    [Pg.24]   
See also in sourсe #XX -- [ Pg.763 , Pg.764 ]




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