Epoxy resin High-bond strength

Table 12.2 describes an epoxy formulation cured with DEAPA. Cure conditions of only 45 min at 100°C are adequate to obtain high bond strength on aluminum and moderately better performance at elevated temperatures than that for systems cured at room temperature. In this formulation the low-molecular-weight, high-epoxy-content resin (EPON 1009)... 

Grade G-10, glass fabric with epoxy resin binder, has extremely high mechanical strength (flexural, impact, and bonding) at room temperature and good dielectric loss and electric strength properties under both dry and humid conditions. 

Epoxides are cylic ethers which are highly reactive because of the strained bond angles of a three-membered ring. Because of the high reactivity of epoxides, they are the starting materials for so-called epoxy resins used for high-strength adhesives. 

Since slower-curing epoxy adhesives systems flow over and wet high-energy surfaces very well, there is little chance for air to become trapped at the interface. As a result, mechanical abrasion is often recommended as a substrate surface treatment prior to application of the epoxy adhesive. The added surface area and the mechanical bonding provided by the additional peaks and valleys on the surface will enhance adhesive strength. If the adhesive does not wet the substrate surface well, such as in the case of epoxy resin on polyethylene, mechanical abrasion is not recommended since it will only encourage the probability of gas voids being trapped at the interface. 

EPOXY A multicomponent resin grout that usually provides very high, tensile, compressive, and bond strengths. 

The adhesive is manufactured in tape form by a hot-melt process. It is a tacky solid at room temperature. The integrity is maintained by using a finely woven glass fabric scrim as the carrier. This process is an excellent example of the compromises required in the technology of formulation. Some of the high-temperature performance that is expected from the phenolic resole is sacrificed for the improved bond strength and toughness afforded from the epoxy resin. The filler is added to make the thermal coefficient of expansion of the cured adhesive more metallic in nature. Dicyandiamide is the... 

High adhesive properties - epoxy resins have high adhesive strengths. Epoxy resins have the unique ability to create electromagnetic bonding forces between the epoxy molecule and the adjacent surface. 

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