Embedment Mechanisms

Taylor et al. (1975) cite several new anchor types, which are defined according to the mechanism of embedmenf or operation  

Schematic diagram of (a) plate anchor, (b) pile anchor, and (c) hydrostatic anchor. 

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The objective of these embedment mechanisms or combinations of mechanisms (1-7) is to embed an anchor plate (fluke) or anchor pile (Figure 10.39) to its design depth, D. The hydrostatic anchor is, by comparison, a surface anchor that relies on suction to attach it to the seabed (Wang et al., 1975,1977) and to resist pullout. The hydrostatic anchor will not be discussed in further detail because of its special nature and limited use to date. 

Special steel alloys with embedded mechanically resistant materials... 

An inclusion can be also captured at a nearly fiat interface by an overgrowth or embedding mechanism as discussed by Chernov [15]. He estimated a critical interface rate for inclusion or gas bubble incorporation depending on the particle... 

Pisani C 1993 Embedded-cluster techniques for the quantum-mechanical study of surface reactivity J. Mol. Catal. 82 229... 

More recently Andrews and Juzeliunas [6, 7] developed a unified tlieory that embraces botli radiationless (Forster) and long-range radiative energy transfer. In otlier words tliis tlieory is valid over tire whole span of distances ranging from tliose which characterize molecular stmcture (nanometres) up to cosmic distances. It also addresses tire intennediate range where neitlier tire radiative nor tire Forster mechanism is fully valid. Below is tlieir expression for tire rate of pairwise energy transfer w from donor to acceptor, applicable to transfer in systems where tire donor and acceptor are embedded in a transparent medium of refractive index ... 

Berendsen, H.J.C., Mavri, J. Quantum dynamics simulation of a small quantum system embedded in a classical environment. In Quantum mechanical simulation methods for studying biological systems, D. Bicout and M. Field, eds. Springer, Berlin (1996) 157-179. 

Pulpstones. Improvements have been made in the composition and speed of the grinding wheel, in methods of feeding the wood and pressing it against the stone, in control of power to the stones, and in the size and capacity of the units. The first pulpstones were manufactured from quarried sandstone, but have been replaced by carbide and alumina embedded in a softer ceramic matrix, in which the harder grit particles project from the surface of the wheel (see Abrasives). The abrasive segments ate made up of three basic manufactured abrasive siUcon carbide, aluminum oxide, or a modified aluminum oxide. Synthetic stones have the mechanical strength to operate at peripheral surface speeds of about 1200—1400 m /min (3900 to 4600 ft/min) under conditions that consume 0.37—3.7 MJ/s (500—5000 hp) pet stone. 

Mechanical Properties. Although wool has a compHcated hierarchical stmcture (see Fig. 1), the mechanical properties of the fiber are largely understood in terms of a two-phase composite model (27—29). In these models, water-impenetrable crystalline regions (generally associated with the intermediate filaments) oriented parallel to the fiber axis are embedded in a water-sensitive matrix to form a semicrystalline biopolymer. The parallel arrangement of these filaments produces a fiber that is highly anisotropic. Whereas the longitudinal modulus of the fiber decreases by a factor of 3 from dry to wet, the torsional modulus, a measure of the matrix stiffness, decreases by a factor of 10 (30). 

These LCT materials have very high tensile and flexural strength, and excellent mechanical and chemical resistance properties. Some commercial LCT are Vectra (Hoechst-Celanese) and Xydar (Amoco). Du Pont, ICI, GE, and Dow Chemical are also suppHers. Their appHcation in electronic embedding is stiU. in its infancy because of the high temperature processing requirement. Nevertheless, this class of thermoplastic polymers will play an important role in electronic embedding. 

The abiHty of a given material to perform as an electronic embedding encapsulant depends largely on its properties. Ultrapure chemical properties with a low level of mobile ions such as sodium, potassium, and chloride are essential. Furthermore, the material s electrical, mechanical, and rheological properties are critical. 

Mechanical Properties. Most of electronic IC devices are very fragile. They need strong mechanical protection from the encapsulant to retain their long-term reUabiUty. Encapsulant must provide mechanical protection but still maintain good temperature-cycle and thermal-shock testing, which are part of the routine reUabiUty testing of the embedding electronics. 

Embedded. Rectangular-cross-section aluminum fin which is wrapped under tension and mechanically embedded in a groove 0.25 0.05 mm (0.010 0.002 in) deep, spirally cut into the outside surface of a tube. 

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