Embedded passives resistors

Embedded passives-designing tor the future FIGURE 21.2 Resistor terminations. 

The trend in surface-mount technology is to use smaller passive devices such as capacitors, resistors, and inductors. Also, there is the use of embedded passive devices, that is, resistors and capacitors that are located within the circuit board laminate. Embedded passive devices free up additional surface area for larger, active components. 

Passive integration is an effective technique to increase the component density. It is defined as a combination of circuit carrier (substrate, board, and interconnections) with passive components like resistors, capacitors, inductors, and line elements in one technology. Passive elements may be integrated on the surface or embedded in a multilayer structure of the substrate. The goal is to achieve ... 

Several AM techniques have been modified to work at a small scale to deposit passive electronic structures (conductors, insulators, resistors, antennas, etc.). These techniques are often known as direct-write techniques and, for instance, use electronic inks that contain nanoparticles or other additives that result in electronic properties after drying, thermal decomposition, or other post-treatment. By combining direct-write techniques with other AM techniques it becomes possible to create multifunctional 3D-embedded electronic structures on a layer-by-laycT basis that combine structural, thermal, electronic, and other functions into a single component. 

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