Electroplating fundamentals

F, A, Lowenhcim (1978) Electroplating- Fundamentals of Surface Finishing Wiley, New York ... 

Electrochemical systems are found in a number of industrial processes. In addition to the subsequent discussions of electrosynthesis, electrochemical techniques are used to measure transport and kinetic properties of systems (see Electroanalyticaltechniques) to provide energy (see Batteries Euel cells) and to produce materials (see Electroplating). Electrochemistry can also play a destmctive role (see Corrosion and corrosion control). The fundamentals necessary to analyze most electrochemical systems have been presented. More details of the fundamentals of electrochemistry are contained in the general references. 

There is naturally a significant difference between the current retail price for most ionic liquids and the current cost of aqueous electroplating solutions. It is difficult to imagine that many ionic liquids will ever approach the desirable 20 / kg level. This is due fundamentally to the synthetic complexity involved in producing ionic liquids. It is, however, essential to comprehend that the cost of the liquids need not necessarily be an issue, as the key driver will be the running costs of the process, of which the capital outlay for the liquid may only be a small component. The overall cost will be made up of ... 

Refs. [i] Schlesinger M, Paunovic M (2000) Modern electroplating 4th edn. Wiley, New York [ii] Paunovic M, Schlesinger M (2006) Fundamentals of electrochemical deposition, 2nd edn. Wiley, New York... 

E. K. Yung and L. T. Romankiw, Fundamental Study of Acid Copper Through-Hole Electroplating Process, J. Electrochem. Soc., 136, No. 3, 756-767 (1989). 

It should be mentioned here that the composition of the electrolyte solution used in these in situ STM studies of the electrochemical deposition of noble metals (platinum, palladium, rhodium and ruthenium) are quite different from those used in the real electroplating industry [56-58]. Although some experimental conditions (temperature, concentration) may be difficult for the in situ STM measurements, electrodeposition in a practical electrolyte bath should provide more information both in application and in fundamental fields. 

The fundamental principles of electroforming are identical to those of electroplating and hence much of the discussion in the last chapter is again relevant. Rather than seeking an even deposit, however, the objective is to plate the metal in an uneven but controlled manner so as to produce the desired shape. 

T. Mooney, Electroplated coatings, in ASM Handbook, Vol. 13A, Corrosion Fundamentals, Testing, and Protection, ASM International, Materials Park, OH, 2003, p. 778. 

---