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Electroplating addition agents

Applications of foimaldehyde and its piodnets in the metal industries include their iiise acid inhibitoi S, reducing agents, and electroplating addition agents. [Pg.344]

Addition Agent a substance added to an electroplating solution to produce a desired change in the physical properties of the electrodeposit. [Pg.1363]

Pyrobrite [ATOTECH]. TM for a bright-leveling, pyrophosphate copper electroplating process. The materials used are copper pyrophosphate trihydrate, potassium pyrophosphate, ammonium hydroxide, and addition agents. [Pg.1062]

Silver-Lume A, B [ATOTECH]. TMfor a bright silver electroplating process for use by silversmiths and electronics manufacturers. The materials used are silver cyanide, potassium cyanide, potassium carbonate, and addition agents. [Pg.1126]

With an applied current of 2 A, the variation in cathode current density is from approximately 2,5 to 85mAcm which covers the working range of most electroplating baths. The Hull cell is also useful as an empirical development tool, e.g. for rapid screening tests on addition agents. The fundamental cell has been modified, for special purposes, in numerous ways. e.g. a bottomless cell may... [Pg.389]

An addition agent for electroplating solutions to prevent the formation of pits or large pores in the electrodeposit. [Pg.465]

The isothiazole ring does not occur in nature. By far the most important synthetic isothiazole derivative is saccharin. This was the first non-carbohydrate sweetening agent to be discovered, as long ago as 1879. It is about 300 times as sweet as sucrose, and is still used in many countries as a non-nutritive sweetener. After it was found that administration of massive doses to rats caused bladder cancer, its use was banned in the New World, but the controversy continues as to whether there is any danger when it is used in small quantity. Saccharin is also used as an additive in electroplating processes (73AHC(15)233). [Pg.173]

On ferrous metals immersion deposition in the copper sulphate bath produces non-adherent deposits, and a cyanide copper undercoat is therefore normally used. Where the use of a cyanide strike cannot be tolerated, an electroplated or immersion nickel deposit has been used . Additions of surface-active agents, often preceded by a sulphuric acid pickle containing the same compound, form the basis of recent methods for plating from a copper sulphate bath directly on to steel ". [Pg.518]


See other pages where Electroplating addition agents is mentioned: [Pg.527]    [Pg.346]    [Pg.361]    [Pg.372]    [Pg.527]    [Pg.238]    [Pg.238]    [Pg.707]    [Pg.886]    [Pg.961]    [Pg.1195]    [Pg.1343]    [Pg.761]    [Pg.980]    [Pg.304]    [Pg.1261]    [Pg.1332]    [Pg.3218]    [Pg.5147]    [Pg.375]    [Pg.390]    [Pg.401]    [Pg.389]    [Pg.389]    [Pg.399]    [Pg.238]    [Pg.238]    [Pg.707]    [Pg.177]    [Pg.179]    [Pg.556]    [Pg.2333]    [Pg.432]    [Pg.346]    [Pg.98]    [Pg.292]    [Pg.391]    [Pg.114]   
See also in sourсe #XX -- [ Pg.12 , Pg.15 ]

See also in sourсe #XX -- [ Pg.12 , Pg.15 ]




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