Electronic devices and assemblies

Recently commercially available X-ray systems for laminography have a spatial resolution limited to hundred microns, which is not enough for modem multilayer electronic devices and assembles. Modem PCBs, flip-chips, BGA-connections etc. can contain contacts and soldering points of 10 to 20 microns. The classical approach for industrial laminography in electronic applications is shown in Fig.2. 

Table 2.7 Thermal conductivities of adhesives and plastics commonly used in electronic devices and assemblies ...

Table 2.5. Thermal Conductivities of Metals and Alloys Commonly Used in Electronic Devices and Assemblies...

The ability to synthesize carbon nanostmctures, such as fullerenes, carbon nanotubes, nanodiamond, and mesoporous carbon functionalize their surface or assemble them into three-dimensional networks has opened new avenues for material design. Carbon nanostructures possess tunable optical, electrical, or mechanical properties, making them ideal candidates for numerous applications ranging from composite structures and chemical sensors to electronic devices and medical implants. 

Electronic devices/systems assembly fiberoptic connectors, 395, 396 luminaire wiring, 394-395 measuring instruments, 392-394 overload protector, 392 Electronic auctions, 271 Electronic boardroom, 134 Electronic commerce (e-commerce), 259-278 and advertising, 272, 273 and associations/referrals, 273... 

The decision to rework electronic devices or assemblies depends on the cost of reworking versus the value of the part. Consumer electronics, due to their low cost, are considered throwaways and seldom reworked. For some, such as plastic-encapsulated microcircuits (PEMs) that are produced in high volumes, rework is impractical because of the difficulty in removing the plastic encapsulant without destroying the components. However, for high-value assemblies, such as densely populated PWBs and MCMs, where the final value may be as high as 10,000 or more, the ability to rework is essential. In such cases, rework may be necessary to meet schedules when small numbers of assemblies are produced. 

Uses Conformal coating film providing physical and moisture banter for electronic devices, optical assemblies, temporary conformable gaskets and seals... 

This field is in its infancy with the future open to growth in new directions. The geometric dimensions of electronic devices and molecular assemblies are moving closer together. As this trend continues it will be possible to prepare solid-state sensors for detection of small numbers of atoms, molecules, and ions in gases, liquids, and in some solids, as well as in living systems. 

Herein, we describe recent developments in the use of porphyrins and phthalocyanines in the field of optical and electronic materials, the properties of which are mainly controlled by molecular self-assembly. Photovoltaic cells are currently of broad interest as potential low-cost approaches to solar energy conversion. Large-area electronic devices and solution-processed organic semiconductors based on porphyrins, phthalocyanines, and other molecules could have potentially a huge cost advantage over Si-based devices if conversion efficiency and durability can be improved to the level of Si-solar cells. We are now approaching this goal as shown herein, where supramolecules based on porphyrins and phthalocyanines may play crucial roles. 

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