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Displacement modulus

Two additional dimensionless groups are therefore required. These can be chosen as the density ratio s y and displacement modulus, Mq = x/d. Hence... [Pg.285]

Fig. 11.10 Values of displacement modulus at which error in creeping flow solution for M t) reaches 5%. Fig. 11.10 Values of displacement modulus at which error in creeping flow solution for M t) reaches 5%.
Morton number, =gii Ap/p a acceleration modulus, = d/U ) dU /dt) displacement modulus, =xjd Mach number, = characteristie velocity/c... [Pg.362]

Much more information can be obtained by examining the mechanical properties of a viscoelastic material over an extensive temperature range. A convenient nondestmctive method is the measurement of torsional modulus. A number of instmments are available (13—18). More details on use and interpretation of these measurements may be found in references 8 and 19—25. An increase in modulus value means an increase in polymer hardness or stiffness. The various regions of elastic behavior are shown in Figure 1. Curve A of Figure 1 is that of a soft polymer, curve B of a hard polymer. To a close approximation both are transpositions of each other on the temperature scale. A copolymer curve would fall between those of the homopolymers, with the displacement depending on the amount of hard monomer in the copolymer (26—28). [Pg.163]

A fully automated microscale indentor known as the Nano Indentor is available from Nano Instmments (257—259). Used with the Berkovich diamond indentor, this system has load and displacement resolutions of 0.3 N and 0.16 nm, respectively. Multiple indentations can be made on one specimen with spatial accuracy of better than 200 nm using a computer controlled sample manipulation table. This allows spatial mapping of mechanical properties. Hardness and elastic modulus are typically measured (259,260) but time-dependent phenomena such as creep and adhesive strength can also be monitored. [Pg.195]

Free- Vibration Methods. Free-vibration instmments subject a specimen to a displacement and allow it to vibrate freely. The oscillations are monitored for frequency and damping characteristics as they disappear. The displacement is repeated again and again as the specimen is heated or cooled. The results are used to calculate storage and loss modulus data. The torsional pendulum and torsional braid analy2er (TBA) are examples of free-vibration instmments. [Pg.197]

Flexibility Stresses Bending and torsional stresses shall be computed using the as-instaUed modulus of elasticity E and then combined in accordance with Eq. (10-100) to determine the computed displacement stress range Sg, which shah not exceed the allowable stress range [Eqs. (10-93) and (10-94).]... [Pg.995]

Table 10-56 gives values for the modulus of elasticity for nonmetals however, no specific stress-limiting criteria or methods of stress analysis are presented. Stress-strain behavior of most nonmetals differs considerably from that of metals and is less well-defined for mathematic analysis. The piping system should be designed and laid out so that flexural stresses resulting from displacement due to expansion, contraction, and other movement are minimized. This concept requires special attention to supports, terminals, and other restraints. [Pg.1004]

F(FG = normal (shear) component of force A = area u(w) = normal (shear) component of displacement o-(e ) = true tensile stress (nominal tensile strain) t(7) = true shear stress (true engineering shear strain) p(A) = external pressure (dilatation) v = Poisson s ratio = Young s modulus G = shear modulus K = bulk modulus. [Pg.298]

Within this regime it is found that the modulus E at one temperature can be related to that at another by a change in the time scale only, that is, there is an equivalenee between time and temperature. This means that the curve describing the modulus at one temperature can be superimposed on that for another by a constant horizontal displacement log (aj) along the log (t) axis, as shown in Fig. 23.5. [Pg.242]

A series of force-distance curves for various materials pairs examined (gold/ nickel, diamond/graphite, diamond/diamond) are shown in Fig. 4 [39]. For an indentation, the unloading slope (dF/dr) of the force-displacement curve is a measure of the contact stiffness and can be used to determine the modulus if the contact area (A) is known using a variant of Eq. 3 below. [Pg.199]

We have recently been exploring this technique to evaluate the adhesive and mechanical properties of compliant polymers in the form of a nanoscale JKR test. The force and stiffness data from a force-displacement curve can be plotted simultaneously (Fig. 13). For these contacts, the stiffness response appears to follow the true contact stiffness, and the curve was fit (see [70]) to a JKR model. Both the surface energy and modulus can be determined from the curve. Using JKR analyses, the maximum pull off force, surface energy and tip radius are... [Pg.210]

Oliver, W.C. and Pharr, G.M., An improved technique for determining hardness and elastic-modulus using load and displacement sensing indentation experiments. J. Mater. Res.,1, 1564-1583 (1992). [Pg.215]

Obviously, the assumptions involved in the foregoing derivation are not entirely consistent. A transverse strain mismatch exists at the boundary between the fiber and the matrix by virtue of Equation (3.8). Moreover, the transverse stresses in the fiber and in the matrix are not likely to be the same because v, is not equal to Instead, a complete match of displacements across the boundary between the fiber and the matrix would constitute a rigorous solution for the apparent transverse Young s modulus. Such a solution can be found only by use of the theory of elasticity. The seriousness of such inconsistencies can be determined only by comparison with experimental results. [Pg.131]

The basis for the determination of an upper bound on the apparent Young s modulus is the principle of minimum potential energy which can be stated as Let the displacements be specified over the surface of the body except where the corresponding traction is 2ero. Let e, Tjy, be any compatible state of strain that satisfies the specified displacement boundary conditions, l.e., an admissible-strain tieldr Let U be the strain energy of the strain state TetcTby use of the stress-strain relations... [Pg.140]

Several other factors affect the frictional forces. If one or both of the contacting surfaces have a relatively low compression modulus it is possible to make intimate contact between the surfaces which will lead to high friction forces in the case of plastics having good adhesion. It can add to the friction forces in another way. The displacement of material in front of the moving object adds a mechanical element to the friction forces. [Pg.95]

Since the early 1980s, the study of mechanical properties of materials on the nanometre scale has received much attention, as these properties are size dependent. The nanoindentation and nanoscratch are the important techniques for probing mechanical properties of materials in small volumes. Indentation load-displacement data contain a wealth of information. From the load-displacement data, many mechanical properties such as hardness and elastic modulus can be determined. The nanoindenter has also been used to measure the fracture toughness and fatigue properties of ul-... [Pg.22]

The two mechanical properties measured most frequently using indentation techniques are the hardness, H, and the elastic modulus, E. A t5pical load-displacement curve of an elastic-plastic sample during and after indentation is presented in Fig. 30, which also serves to define some of the experimental quantities involved in the measurement. [Pg.23]

Once the contact area is determined from the load-displacement data, the hardness, H, and effective elastic modulus, Egff, follow from ... [Pg.24]

Oliver, W. C., and Pharr, G. M., An Improved Technique for Determining Hardness and Elastic Modulus Using Load and Displacement Sensing Indentation Experiments, J. Mater. Res., Vol. 7,1992, pp. 1564-1583. [Pg.35]


See other pages where Displacement modulus is mentioned: [Pg.289]    [Pg.384]    [Pg.98]    [Pg.289]    [Pg.384]    [Pg.98]    [Pg.438]    [Pg.184]    [Pg.175]    [Pg.201]    [Pg.308]    [Pg.882]    [Pg.107]    [Pg.403]    [Pg.193]    [Pg.196]    [Pg.202]    [Pg.206]    [Pg.207]    [Pg.208]    [Pg.212]    [Pg.449]    [Pg.323]    [Pg.325]    [Pg.94]    [Pg.112]    [Pg.192]    [Pg.176]    [Pg.115]    [Pg.7]    [Pg.798]   
See also in sourсe #XX -- [ Pg.285 , Pg.297 ]




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