Diglycidyl ether bisphenol cured

Figure 15.2 (a) Bisphenol A diglycidyl ether, (b) Curing reaction on an epoxy resin with a diamine. 

The term epoxy is familiar to nonchemists because of the widespread use of epoxy glues and resins. These are crosslinked polyether thermoplastics made from a liquid resin which is typically a mixture of bisphenol A diglycidyl ether (70) and a polymer (71 Scheme 86). The liquid resin is cured or hardened to the final resin by mixing with a crosslinking reagent, which can be an acid, a di- or poly-alcohol, or a di- or poly-amine (Scheme 86). 

The diglycidyl ether (DGEBA) and the polyglycidyl compound (PGCBA) were mixed and heated to about 120 °C. The stoichiometric amount of bisphenol A was dissolved in the resin and, after cooling to about 60 °C, 0,1% by weight of 2-ethyl-4-methyl-imidazol was added to the mixture. The well stirred composition was degassed in a vacuum oven in order to remove trapped air. Afterwards, the reactive mixture was poured into preheated moulds and cured for two hours at 140 °C followed by two hours at 180 °C. 

Applications with real composites have been performed in order to verify the results so far outlined. Namely, a metalfilled epoxy composite was selected, whose matrix material was a diglycidyl ether of bisphenol-A resin, cured with 8 percent by weight of the resin, triethylene-tetramine. 

Figure 2. Solid-state spectra of four different epoxies (hosed on the resin diglycidyl ether of bisphenol-A) are compared with the liquid-state spectra of their respective unreacted components, The chemical compositions are in Table I. Here the epoxies are identified by their main curing agent (a) PIP—piperidine (b) MPDA—metaphenylene diamine (c) HHPA—hexahydro-phthalic anhydride (d) NMA—nadic methyl anhydride.

Yamani and Young (5) applied the theory to explain the plastic deformation of a diglycidyl ether of bisphenol A (DGEBA) epoxy resin cured with various amount of triethylene tetramine (TETA). They found that the theory gave a reasonable description for the resins below the glass transition temperatures T. ... 

We have undertaken a systanatic investigation of the effect on cured resin physical properties of various alkyl groups on the MFD aromatic ring. In this report we present static and dynamic mecdaniccd properties, density measurenents, and glass treuisition tenperature (Tg) measuremmits of diglycidyl ether of bisphenol-A (DGEBA) cured with various alkylated MFD s. 

The phase separation behavior during curing of polyetherimide (PEI) modified diglycidyl ether of bisphenol A (DGEBA) epoxy and PEI modified bisphenol A dicyanate (BPACY) were studied using SEM, light scattering, and dynamic mechanical analyzer. 

Diglycidyl ether of bisphenol-A (DGEBA), epoxy resin (YD 128, Kuk Do Chem., Mn = 378), and bisphenol-A dicyanate (BPACY, Arocy B-10, Ciba-Geigy) were used as the thermoset resin. 4,4 -diaminodiphenyl sulfone (DDS, Aldrich Chem. Co.) was used as a curing agent for epoxy. Polyetherimide (PEI, Ultem 1000, General Electric Co., M = 18,000) and 2-methyl imidazole (2MZ, Aldrich Chem. Co.) were used as the thermoplastic modifier and catalyst. 

Preparation of a Cured Epoxy Resin by the Room Temperature Reaction of Bisphenol A Diglycidyl Ether with Polyamines... 

Fig. 11. Plot of log relaxation times versus reciprocal temperature for the diglycidyl ether of bisphenol. A cured with methylenedianiline at 100 °C561...

CA 62, 395(1965) [A castable expl compn provided by curing a mixture contg 50—80% powdered hydrazine nitrate, 13—40% binder (such as a polyester of mol wt 500—5000 derived from polyhydric ales and polybasic acids), and 3—10% curing agent (such as a diglycidyl ether of bisphenol A or.F), powd metals (such as Mg, Al, Ti, etc) 5—15%, and minor propns... 

Table 1. Gk values measured at room temperature for Diglycidyl ether of bisphenol A (DGEBA) epoxy resins cured with various hardeners 11...

The complex sorption behavior of the water in amine-epoxy thermosets is discussed and related to depression of the mechanical properties. The hypothesized sorption modes and the corresponding mechanisms of plasticization are discussed on the basis of experimental vapor and liquid sorption tests, differential scanning calorimetry (DSC), thermomechanical analysis (TMA) and dynamic mechanical analysis. In particular, two different types of epoxy materials have been chosen low-performance systems of diglycidyl ether of bisphenol-A (DGEBA) cured with linear amines, and high-performance formulations based on aromatic amine-cured tetraglycidyldiamino diphenylmethane (TGDDM) which are commonly used as matrices for carbon fiber composites. 

Fig. 9. Plot of log T, relaxation time vs. reciprocal temperature for the diglycidyl ether of bisphenol-A uncured (A) and cured with methylenedianiline at 54 °C (B), 100 °C (C) and 180 °C (D) (adapted from Refs.53) and16y)...

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